Influence of different stirring speed on fracture properties of wedge splitting specimens

2021 ◽  
pp. 1-7
Author(s):  
Baoyuan Wang ◽  
Tong Qianhao
Keyword(s):  
Fracture Properties ◽  
Wedge Splitting

Experimental Study of the Influence of the Initial Notch Length in Cubical Concrete Wedge-Splitting Test Specimens

2012 ◽  
Vol 525-526 ◽  
pp. 209-212 ◽  
Author(s):  
Sara Korte ◽  
Veerle Boel ◽  
Wouter de Corte ◽  
Geert de Schutter ◽  
Stanislav Seitl
Keyword(s):  
Mouth Opening ◽  
Heterogeneous Material ◽  
Crack Mouth Opening Displacement ◽  
Opening Displacement ◽  
Test Configuration ◽  
Fracture Properties ◽  
Wedge Splitting Test ◽  
Splitting Test ◽  
Notch Length ◽  
Wedge Splitting

The wedge-splitting test (WST) is a frequently used test configuration for performing stable crack fracture experiments on concrete specimens, thus allowing to determine the fracture process and crack propagation in the heterogeneous material. However, there are no standard rules regarding the wedge-splitting specimens geometry, groove dimensions or notch length. This paper concentrates on the influence of the initial notch length in geometrically identical, cubical specimens, cast from vibrated concrete. The experimental results of nine WSTs under monotonic loading, including Fsp-CMOD curves - splitting force versus crack mouth opening displacement - and fracture energy Gf, are presented. An important effect of the starting notch length on the fracture properties is observed.

Micromechanics Measurements Applied to Integrated Circuit Microelectronics

1997 ◽  
Vol 473 ◽  
Author(s):  
David R. Clarke
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
Fracture Resistance ◽  
Interface Fracture ◽  
New Techniques ◽  
Fracture Properties ◽  
Engineered Structures ◽  
Mechanical And Fracture Properties ◽  
Interconnect Lines ◽  
Metallic Interconnect

ABSTRACTAs in other engineered structures, fracture occasionally occurs in integrated microelectronic circuits. Fracture can take a number of forms including voiding of metallic interconnect lines, decohesion of interfaces, and stress-induced microcracking of thin films. The characteristic feature that distinguishes such fracture phenomena from similar behaviors in other engineered structures is the length scales involved, typically micron and sub-micron. This length scale necessitates new techniques for measuring mechanical and fracture properties. In this work, we describe non-contact optical techniques for probing strains and a microscopic “decohesion” test for measuring interface fracture resistance in integrated circuits.

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