Fabrication of a large-scale Ni stamp using a multi-level SU-8 photoresist mold for advanced printed circuit board manufacturing

2011 ◽  
Vol 21 (6) ◽  
pp. 065026 ◽  
Author(s):  
H-S Lee ◽  
H-H Yang ◽  
S Ra ◽  
J-B Yoon
1999 ◽  
Vol 09 (03) ◽  
pp. 215-222
Author(s):  
JOHN LAU ◽  
CHRIS CHANG ◽  
MAURICE LEE ◽  
DAVID CHENG ◽  
TZYY JANG TSENG

2021 ◽  
Author(s):  
Carles Ribas Tugores ◽  
Gerald Birngruber ◽  
Jürgen Fluch ◽  
Angelika Swatek ◽  
Gerald Schweiger

1992 ◽  
Vol 114 (4) ◽  
pp. 425-435 ◽  
Author(s):  
S. Praharaj ◽  
S. Azarm

In this paper, a new approach for optimization-based design of nonlinearly mixed discrete-continuous problems has been developed. The approach is based on a two-level decomposition strategy in which the entire domain of variables is partitioned into two levels, one involving the continuous variables and the other involving the discrete variables. Variables in one level are optimized for fixed values of the variable from the other level. A modified penalty function is formed, based on monotonicity analysis, to solve for the discrete variables, and a conventional optimization method is used to solve for the continuous variables. To improve the computational effectiveness of the approach, a constrained derivative relationship is also adopted. The performance of the entire algorithm is then demonstrated through an example involving a simplified model for printed circuit board assemblies. The objective in the example is to maximize assembly reliability by: (1) adding redundant components to the boards, and (2) optimally distributing allocated mass flow to the individual channels of the circuit boards. Number of variables in the example is then varied to investigate the effectiveness and potential of the approach for large-scale problems.


Circuit World ◽  
2008 ◽  
Vol 34 (2) ◽  
pp. 21-26 ◽  
Author(s):  
David R. Selviah ◽  
F. Aníbal Fernández ◽  
Ioannis Papakonstantinou ◽  
Kai Wang ◽  
Hadi Bagshiahi ◽  
...  

Circuit World ◽  
2002 ◽  
Vol 28 (2) ◽  
pp. 11-13 ◽  
Author(s):  
Paavo Jalonen ◽  
Aulis Tuominen

Photolithographic techniques are universally employed in multi‐layer printed circuit board manufacturing. The growing demand for miniaturization of electronics means that finer lines and smaller vias are increasingly required and these very fine lines on the substrate are increasingly difficult to produce by conventional means. One very promising means of meeting these fine line requirements is via the etching of sputtered thin films on a substrate and then growing copper on these lines using an additive method. In this work we tested the capability of an electrodeposited, positive‐acting photoresist for patterning thin film circuits on sputtered seed layers such as chromium. A fully additive electroless copper was then used to produce the copper lines. Epoxy reinforced fibreglass was used as a core material. The performance and quality properties of the process were examined, along with limitations of the process when compared with both a conventional dry film method and a spin coating method.


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