2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
Latest Publications

TOTAL DOCUMENTS

142

(FIVE YEARS 0)

H-INDEX

4

(FIVE YEARS 0)

Published By IEEE

9784990218850

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Relationship between natural convection cooling performance and tilt angle of thin enclosure

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.23919/icep.2018.8374346 ◽

2018 ◽

Author(s):

Shun Yonezuka ◽

Takashi Fukue ◽

Mamoru Kikuchi ◽

Koichi Hirose ◽

Qiang-Sheng Wang ◽

...

Keyword(s):

Natural Convection ◽

Cooling Performance ◽

Convection Cooling

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Development of the integrated passive device using through-glass-via substrate

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.23919/icep.2018.8374661 ◽

2018 ◽

Author(s):

Jun Onohara ◽

Fusao Takagi ◽

Takashi Kizu ◽

Koji Imayoshi ◽

Hironori Nomura ◽

...

Keyword(s):

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Loop height assessment for automotive package

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.23919/icep.2018.8374356 ◽

2018 ◽

Author(s):

Mohd Izzuddin Suboh ◽

Mohamad Syahirul Syafiq Ali

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The failure mode of Bi and Ni-doped Sn-Ag-Cu solder joint under electromigration tests

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.23919/icep.2018.8374708 ◽

2018 ◽

Author(s):

T. C. Lin ◽

H. Y. Kung ◽

S. H. Lee ◽

M. H. Chen ◽

Y. T. Chiu ◽

...

Keyword(s):

Solder Joint ◽

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Development of an automatic urine monitoring device using cross-selectivity sensing principle

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.23919/icep.2018.8374315 ◽

2018 ◽

Author(s):

Benjamin Ioller ◽

Norihisa Miki

Keyword(s):

Monitoring Device

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Fabrication of microchannel-TEM grid for in situ liquid observation of interfacial chemical reaction

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.23919/icep.2018.8374305 ◽

2018 ◽

Author(s):

K. Miwa ◽

H. Kuwae ◽

K. Sakamoto ◽

S. Shoji ◽

J. Mizuno

Keyword(s):

Chemical Reaction ◽

Interfacial Chemical Reaction ◽

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SiP module warpage characterization and simulation study

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.23919/icep.2018.8374659 ◽

2018 ◽

Author(s):

Jim Hsu ◽

Anthony Yang ◽

Yonghyuk Jeong ◽

Billy Ahn ◽

Tetsuya Koyama ◽

...

Keyword(s):

Simulation Study

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Void reduction in reflow soldering processes by sweep stimulation of PCB substrate

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.23919/icep.2018.8374312 ◽

2018 ◽

Author(s):

Viktoria Rawinski

Keyword(s):

Reflow Soldering ◽

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Design and fabrication of photo-sensitive thin-film transistors with IGZO and organic photo-absorber

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.23919/icep.2018.8374672 ◽

2018 ◽

Author(s):

Zhaogui Wang ◽

Yongfeng Zheng ◽

Xuhong Cao ◽

Hang Zhou ◽

Chuan Liu

Keyword(s):

Thin Film ◽

Thin Film Transistors

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Coupling model and non-contact measurement approach by near-field technology

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.23919/icep.2018.8374648 ◽

2018 ◽

Author(s):

Sheng-Wei Guan ◽

Chih-Wen Kuo ◽

Cheng-Tao Li ◽

Sung-Mao Wu

Keyword(s):

Coupling Model ◽

Contact Measurement ◽

Measurement Approach

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