2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
Latest Publications

TOTAL DOCUMENTS

142

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9784990218850

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Creep mechanism in characteristic orientation of Sn and Sn-1.8Ag by nanoindentation

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.23919/icep.2018.8374707 ◽

2018 ◽

Author(s):

P. J. Chiang ◽

J. Y. Wu ◽

Y. C. Liao ◽

C. R. Kao

Keyword(s):

Creep Mechanism

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Electric current-induced plastic deformation: An in situ experimental study

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.23919/icep.2018.8374702 ◽

2018 ◽

Author(s):

Yu-chen Liu ◽

Shih-kang Lin

Keyword(s):

Experimental Study ◽

Plastic Deformation ◽

Electric Current

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Coupling model and non-contact measurement approach by near-field technology

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.23919/icep.2018.8374648 ◽

2018 ◽

Author(s):

Sheng-Wei Guan ◽

Chih-Wen Kuo ◽

Cheng-Tao Li ◽

Sung-Mao Wu

Keyword(s):

Near Field ◽

Coupling Model ◽

Contact Measurement ◽

Measurement Approach

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High spatial-resolution X-ray inspection by pixelated scintillator

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.23919/icep.2018.8374703 ◽

2018 ◽

Author(s):

Sho Miyao ◽

Takahiro Tanino ◽

Nobuyasu Fujioka ◽

Izumi Hikita ◽

Tomohiro Morinaga ◽

...

Keyword(s):

Spatial Resolution ◽

High Spatial Resolution ◽

X Ray

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Variation in electrical resistivity of stretchable printed wires composed a polyurethane-based binder containing silver fillers under cyclic tensions

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.23919/icep.2018.8374647 ◽

2018 ◽

Author(s):

Yuta Hosono ◽

Masahiro Inoue

Keyword(s):

Electrical Resistivity

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Ga-based submicron particle and applications

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.23919/icep.2018.8374331 ◽

2018 ◽

Cited By ~ 1

Author(s):

Hseng-ming Liao ◽

Che-yu Yeh ◽

Shih-kang Lin

Keyword(s):

Submicron Particle

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Experimental study of through glass via effects on high frequency electrical characteristics

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.23919/icep.2018.8374699 ◽

2018 ◽

Cited By ~ 3

Author(s):

Masaya Tanaka ◽

Yumi Okazaki ◽

Junichi Suyama ◽

Satoru Kuramochi ◽

Younggun Han ◽

...

Keyword(s):

Experimental Study ◽

High Frequency ◽

Electrical Characteristics

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Organizing committee

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.23919/icep.2018.8374294 ◽

2018 ◽

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Evaluation of residual thermal stress in Cu metalized silicon nitride substrates by raman spectroscopy

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.23919/icep.2018.8374701 ◽

2018 ◽

Cited By ~ 4

Author(s):

Kiyoshi Hirao ◽

Shinji Fukuda ◽

Hiroyuki Miyazaki ◽

You Zhou ◽

Hideki Hyuga ◽

...

Keyword(s):

Raman Spectroscopy ◽

Thermal Stress ◽

Silicon Nitride ◽

Residual Thermal Stress

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Relationship between natural convection cooling performance and tilt angle of thin enclosure

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) ◽

10.23919/icep.2018.8374346 ◽

2018 ◽

Author(s):

Shun Yonezuka ◽

Takashi Fukue ◽

Mamoru Kikuchi ◽

Koichi Hirose ◽

Qiang-Sheng Wang ◽

...

Keyword(s):

Natural Convection ◽

Tilt Angle ◽

Cooling Performance ◽

Convection Cooling

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2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Creep mechanism in characteristic orientation of Sn and Sn-1.8Ag by nanoindentation

Electric current-induced plastic deformation: An in situ experimental study

Coupling model and non-contact measurement approach by near-field technology

High spatial-resolution X-ray inspection by pixelated scintillator

Variation in electrical resistivity of stretchable printed wires composed a polyurethane-based binder containing silver fillers under cyclic tensions

Ga-based submicron particle and applications

Experimental study of through glass via effects on high frequency electrical characteristics

Organizing committee

Evaluation of residual thermal stress in Cu metalized silicon nitride substrates by raman spectroscopy

Relationship between natural convection cooling performance and tilt angle of thin enclosure

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
Latest Publications