The paper focused in addressing the auto align defect at in-strip testing of a semiconductor scalable device in a leadframe technology. Pareto diagram and potential risk analysis were completed to identify the top reject contributors and eventually come-up with the robust solution. Reverse flow was employed to eliminate the alignment issues. The reverse flow, which is testing prior singulation process, eventually resolved the auto align and other singulation related defects as testing is done on a strip form. Ultimately, the error-proofing or Poka-Yoke approach by reverse flow lead to the elimination of auto align failures at final test. For future works, the parameters and learnings could be used on devices with similar assembly defect occurrence.
Process optimization and thermal risk analysis for 1,3,5-trihydroxy-2,4,6-trinitrobenzenen synthesis
