2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Effect of Surface Finish on the Fatigue Behavior of Bi-based Solder Joints

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2019.8757419 ◽

2019 ◽

Cited By ~ 4

Author(s):

Sinan Su ◽

Minghong Jian ◽

Xin Wei ◽

Francy John Akkara ◽

Sa'd Hamasha ◽

...

Keyword(s):

Surface Finish ◽

Solder Joints ◽

Fatigue Behavior ◽

Effect Of Surface

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A Design Methodology for Controlling Local Airflow Delivery in Data Centers Using Air Dampers

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2019.8757270 ◽

2019 ◽

Cited By ~ 5

Author(s):

Ghazal Mohsenian ◽

Sadegh Khalili ◽

Bahgat Sammakia

Keyword(s):

Design Methodology ◽

Data Centers

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Conference Technical Program

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2019.8757365 ◽

2019 ◽

Keyword(s):

Technical Program

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Experimental Performance of Completely Passive Single and Recirculating Loop Thermosyphon Cooling Systems using Low GWP R1234ze and R1234yf

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2019.8757374 ◽

2019 ◽

Cited By ~ 1

Author(s):

Filippo Cataldo ◽

John Richard Thome

Keyword(s):

Cooling Systems ◽

Experimental Performance

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Analysis of Heat Transfer from a Heat Dissipating Device on a Substrate

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2019.8756498 ◽

2019 ◽

Author(s):

Joao Vitor Thomsen Silveira ◽

Zidi Li ◽

Bolun Yang ◽

Ryuta Yasui ◽

Takuya Shinoda ◽

...

Keyword(s):

Heat Transfer

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Unprecedented Capillary Evaporative Heat Flux in Nanochannels

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2019.8757337 ◽

2019 ◽

Author(s):

Masoumeh Nazari ◽

Matt Gorman ◽

Hadi Ghasemi

Keyword(s):

Heat Flux

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A Novel Biomimetic Flapping Fan for Electronics Cooling

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2019.8757349 ◽

2019 ◽

Author(s):

Jingru Benner ◽

Mehdi Mortazavi ◽

Anthony D. Santamaria ◽

Shun Su ◽

Tony Nguyen

Keyword(s):

Electronics Cooling

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Effect of Aging on the Fatigue Life and Shear Strength of SAC305 Solder Joints in Actual Setting Conditions

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2019.8757269 ◽

2019 ◽

Cited By ~ 6

Author(s):

Raed Al Athamneh ◽

Mohammed Abueed ◽

Dania Bani Hani ◽

Sinan Su ◽

Sa'd Hamasha ◽

...

Keyword(s):

Shear Strength ◽

Fatigue Life ◽

Solder Joints ◽

Sac305 Solder

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Experimental Investigation of Resonant Flow Pulsation in Mesochannels Embedded with Wavy Fins

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2019.8757378 ◽

2019 ◽

Author(s):

Jaakko McEvoy ◽

Tim Persoons

Keyword(s):

Experimental Investigation ◽

Flow Pulsation

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2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Effect of Surface Finish on the Fatigue Behavior of Bi-based Solder Joints

A Design Methodology for Controlling Local Airflow Delivery in Data Centers Using Air Dampers

Table of Contents

Conference Technical Program

Experimental Performance of Completely Passive Single and Recirculating Loop Thermosyphon Cooling Systems using Low GWP R1234ze and R1234yf

Analysis of Heat Transfer from a Heat Dissipating Device on a Substrate

Unprecedented Capillary Evaporative Heat Flux in Nanochannels

A Novel Biomimetic Flapping Fan for Electronics Cooling

Effect of Aging on the Fatigue Life and Shear Strength of SAC305 Solder Joints in Actual Setting Conditions

Experimental Investigation of Resonant Flow Pulsation in Mesochannels Embedded with Wavy Fins

Export Citation Format

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Effect of Surface Finish on the Fatigue Behavior of Bi-based Solder Joints

A Design Methodology for Controlling Local Airflow Delivery in Data Centers Using Air Dampers

Table of Contents

Conference Technical Program

Experimental Performance of Completely Passive Single and Recirculating Loop Thermosyphon Cooling Systems using Low GWP R1234ze and R1234yf

Analysis of Heat Transfer from a Heat Dissipating Device on a Substrate

Unprecedented Capillary Evaporative Heat Flux in Nanochannels

A Novel Biomimetic Flapping Fan for Electronics Cooling

Effect of Aging on the Fatigue Life and Shear Strength of SAC305 Solder Joints in Actual Setting Conditions

Experimental Investigation of Resonant Flow Pulsation in Mesochannels Embedded with Wavy Fins

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Latest Publications