2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Experimental Performance of Completely Passive Single and Recirculating Loop Thermosyphon Cooling Systems using Low GWP R1234ze and R1234yf

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2019.8757374 ◽

2019 ◽

Cited By ~ 1

Author(s):

Filippo Cataldo ◽

John Richard Thome

Keyword(s):

Cooling Systems ◽

Experimental Performance

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Analysis of Heat Transfer from a Heat Dissipating Device on a Substrate

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2019.8756498 ◽

2019 ◽

Author(s):

Joao Vitor Thomsen Silveira ◽

Zidi Li ◽

Bolun Yang ◽

Ryuta Yasui ◽

Takuya Shinoda ◽

...

Keyword(s):

Heat Transfer

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Unprecedented Capillary Evaporative Heat Flux in Nanochannels

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2019.8757337 ◽

2019 ◽

Author(s):

Masoumeh Nazari ◽

Matt Gorman ◽

Hadi Ghasemi

Keyword(s):

Heat Flux

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A Novel Biomimetic Flapping Fan for Electronics Cooling

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2019.8757349 ◽

2019 ◽

Author(s):

Jingru Benner ◽

Mehdi Mortazavi ◽

Anthony D. Santamaria ◽

Shun Su ◽

Tony Nguyen

Keyword(s):

Electronics Cooling

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Effect of Aging on the Fatigue Life and Shear Strength of SAC305 Solder Joints in Actual Setting Conditions

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2019.8757269 ◽

2019 ◽

Cited By ~ 6

Author(s):

Raed Al Athamneh ◽

Mohammed Abueed ◽

Dania Bani Hani ◽

Sinan Su ◽

Sa'd Hamasha ◽

...

Keyword(s):

Shear Strength ◽

Fatigue Life ◽

Solder Joints ◽

Sac305 Solder

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Experimental Investigation of Resonant Flow Pulsation in Mesochannels Embedded with Wavy Fins

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2019.8757378 ◽

2019 ◽

Author(s):

Jaakko McEvoy ◽

Tim Persoons

Keyword(s):

Experimental Investigation ◽

Flow Pulsation

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Pool Boiling Experiment of Dielectric Liquids and Numerical Study for Cooling a Microprocessor

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2019.8757380 ◽

2019 ◽

Cited By ~ 1

Author(s):

Omidreza Ghaffari ◽

Francis Grenier ◽

Jean-Francois Morissette ◽

Martin Bolduc ◽

Simon Jasmin ◽

...

Keyword(s):

Numerical Study ◽

Pool Boiling ◽

Dielectric Liquids

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Understanding Trade-Offs of Phase Change Materials for Transient Thermal Mitigation

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2019.8757253 ◽

2019 ◽

Author(s):

Lauren Boteler ◽

Michael Fish ◽

Morris Berman ◽

Justin Wang

Keyword(s):

Phase Change ◽

Phase Change Materials ◽

Trade Offs ◽

Transient Thermal ◽

Thermal Mitigation

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Mechanical Behavior Evolution of SAC305 Lead Free Solder Joints under Thermal Cycling

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2019.8757273 ◽

2019 ◽

Cited By ~ 1

Author(s):

Abdullah Fahim ◽

Kamrul Hasan ◽

Sudan Ahmed ◽

Jeffrey C. Suhling ◽

Pradeep Lall

Keyword(s):

Thermal Cycling ◽

Mechanical Behavior ◽

Solder Joints ◽

Lead Free ◽

Lead Free Solder ◽

Free Solder

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A Single Flexible Coldplate Cools Multiple Devices

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2019.8757281 ◽

2019 ◽

Cited By ~ 1

Author(s):

Shurong Tian ◽

Todd Takken ◽

Mark Schultz ◽

Yuan Yao ◽

Paul Coteus ◽

...

Keyword(s):

Multiple Devices

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2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Experimental Performance of Completely Passive Single and Recirculating Loop Thermosyphon Cooling Systems using Low GWP R1234ze and R1234yf

Analysis of Heat Transfer from a Heat Dissipating Device on a Substrate

Unprecedented Capillary Evaporative Heat Flux in Nanochannels

A Novel Biomimetic Flapping Fan for Electronics Cooling

Effect of Aging on the Fatigue Life and Shear Strength of SAC305 Solder Joints in Actual Setting Conditions

Experimental Investigation of Resonant Flow Pulsation in Mesochannels Embedded with Wavy Fins

Pool Boiling Experiment of Dielectric Liquids and Numerical Study for Cooling a Microprocessor

Understanding Trade-Offs of Phase Change Materials for Transient Thermal Mitigation

Mechanical Behavior Evolution of SAC305 Lead Free Solder Joints under Thermal Cycling

A Single Flexible Coldplate Cools Multiple Devices

Export Citation Format

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Experimental Performance of Completely Passive Single and Recirculating Loop Thermosyphon Cooling Systems using Low GWP R1234ze and R1234yf

Analysis of Heat Transfer from a Heat Dissipating Device on a Substrate

Unprecedented Capillary Evaporative Heat Flux in Nanochannels

A Novel Biomimetic Flapping Fan for Electronics Cooling

Effect of Aging on the Fatigue Life and Shear Strength of SAC305 Solder Joints in Actual Setting Conditions

Experimental Investigation of Resonant Flow Pulsation in Mesochannels Embedded with Wavy Fins

Pool Boiling Experiment of Dielectric Liquids and Numerical Study for Cooling a Microprocessor

Understanding Trade-Offs of Phase Change Materials for Transient Thermal Mitigation

Mechanical Behavior Evolution of SAC305 Lead Free Solder Joints under Thermal Cycling

A Single Flexible Coldplate Cools Multiple Devices

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Latest Publications