2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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9781728124612
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Effect of Surface Finish on the Fatigue Behavior of Bi-based Solder Joints

2019 ◽  
Author(s):  
Sinan Su ◽  
Minghong Jian ◽  
Xin Wei ◽  
Francy John Akkara ◽  
Sa'd Hamasha ◽  
...  
Keyword(s):  
Surface Finish ◽  
Solder Joints ◽  
Fatigue Behavior ◽  
Effect Of Surface

Analysis of Heat Transfer from a Heat Dissipating Device on a Substrate

2019 ◽  
Author(s):  
Joao Vitor Thomsen Silveira ◽  
Zidi Li ◽  
Bolun Yang ◽  
Ryuta Yasui ◽  
Takuya Shinoda ◽  
...  
Keyword(s):  
Heat Transfer

A Novel Biomimetic Flapping Fan for Electronics Cooling

2019 ◽  
Author(s):  
Jingru Benner ◽  
Mehdi Mortazavi ◽  
Anthony D. Santamaria ◽  
Shun Su ◽  
Tony Nguyen
Keyword(s):  
Electronics Cooling
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