scholarly journals Effect of surface etching and electrodeposition of copper on nitinol

Author(s):  
E Ramos-Moore ◽  
A Rosenkranz ◽  
L F Matamala ◽  
A Videla ◽  
A Durán ◽  
...  
2015 ◽  
Vol 21 (3) ◽  
pp. 600-606 ◽  
Author(s):  
Ju-Young Kong ◽  
Tae-Hoon Kim ◽  
Seong-Rae Lee ◽  
Hyo-Jun Kim ◽  
Min-Woo Lee ◽  
...  

2017 ◽  
Vol 707 ◽  
pp. 337-343 ◽  
Author(s):  
Seung Mi Baek ◽  
Alexander V. Polyakov ◽  
Ji Hyun Moon ◽  
Irina P. Semenova ◽  
Ruslan Z. Valiev ◽  
...  

Langmuir ◽  
2010 ◽  
Vol 26 (10) ◽  
pp. 7153-7156 ◽  
Author(s):  
Fengpo Yan ◽  
Lihua Huang ◽  
Jinsheng Zheng ◽  
Jin Huang ◽  
Zhang Lin ◽  
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2016 ◽  
Vol 30 (2) ◽  
pp. 871-877 ◽  
Author(s):  
Sung Chul Seok ◽  
Jae Won Park ◽  
Jiyeon Jung ◽  
Chonggun Choi ◽  
Gyu Hong Choi ◽  
...  

2019 ◽  
Vol 963 ◽  
pp. 119-122
Author(s):  
Tawhid Rana ◽  
Gil Yong Chung ◽  
Steve Anderson ◽  
Ian Manning ◽  
Willie Bowen ◽  
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Epilayers grown on substrates etched by various etching conditions were studied for stacking fault defects. Substrates were etched by H2, H2+ HCl and H2 + CxHy gases prior to epilayer growth for comparison. High density of SF was observed in the epilayers when H2+HCl or H2+CxHy gas mixtures were used. On the other hand, much lower density of stacking faults (SF) (<1 cm-2) was observed in the epilayer grown on the surface etched by only H2 gas. However, a high number of pits were generated in the epilayer grown on substrate etched by H2 only, which can be considered to be tradeoff of achieving low SF in epilayer by substrate etching. We also conclude from our experimental results that C rich surface is more favorable to generate SF in epilayer compared to Si rich surface.


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