New technologies for a sustainable printed circuit board manufacturing process: further results

Circuit World ◽  
2006 ◽  
Vol 32 (4) ◽  
pp. 19-24 ◽  
Author(s):  
Narinder Bains ◽  
Kate Geraghty ◽  
Martin Goosey
Keyword(s):  
Manufacturing Process ◽  
Printed Circuit Board ◽  
New Technologies ◽  
Circuit Board ◽  
Printed Circuit ◽  
Printed Circuit Board Manufacturing

Process Improvement Using Design by Experiments

1994 ◽  
Author(s):  
Hsien-chen Li ◽  
Fuyau Lin
Keyword(s):  
Process Improvement ◽  
Manufacturing Process ◽  
Printed Circuit Board ◽  
Fractional Factorial Design ◽  
Time Budget ◽  
Fractional Factorial ◽  
Circuit Board ◽  
Printed Circuit ◽  
Printed Circuit Board Manufacturing

Abstract This paper present an approach to apply Design by Experiments for process improvement with the objectives to minimize cost and shorten investigation time. A case study of PCB (Printed Circuit Board) manufacturing process is chosen to illustrate this approach. A Fractional Factorial Design by Experiment was performed due to the constraints of the time, budget, and resources.

PRINTED CIRCUIT BOARD MANUFACTURING AND TESTING OF RIMM™

1999 ◽  
Vol 09 (03) ◽  
pp. 215-222
Author(s):  
JOHN LAU ◽  
CHRIS CHANG ◽  
MAURICE LEE ◽  
DAVID CHENG ◽  
TZYY JANG TSENG
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Printed Circuit Board Manufacturing

Evaluation of new technologies and materials for printed circuit boards with improved heat dissipation properties

Circuit World ◽  
2016 ◽  
Vol 42 (1) ◽  
pp. 32-36 ◽  
Author(s):  
Michal Baszynski ◽  
Edward Ramotowski ◽  
Dariusz Ostaszewski ◽  
Tomasz Klej ◽  
Mariusz Wojcik ◽  
...  
Keyword(s):  
Thermal Properties ◽  
Printed Circuit Boards ◽  
Heat Dissipation ◽  
Printed Circuit Board ◽  
New Technologies ◽  
Electronic Device ◽  
Circuit Board ◽  
New Materials ◽  
Content Type ◽  
Printed Circuit

Purpose – The purpose of this paper is to evaluate thermal properties of printed circuit board (PCB) made with use of new materials and technologies. Design/methodology/approach – Four PCBs with the same layout but made with use of different materials and technologies have been investigated using thermal camera to compare their thermal properties. Findings – The results show how important the thermal properties of PCBs are for providing effective heat dissipation, and how a simple alteration to the design can help to improve the thermal performance of electronic device. Proper layout, new materials and technologies of PCB manufacturing can significantly reduce the temperature of electronic components resulting in higher reliability of electronic and power electronic devices. Originality/value – This paper shows the advantages of new technologies and materials in PCB thermal management.

Sign in / Sign up

Export Citation Format

Share Document