Thermal analysis and modeling of 3D integrated circuits for test scheduling

2013 IEEE International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2013.6702374 ◽

2013 ◽

Author(s):

Indira Rawat ◽

M. K. Gupta ◽

Virendra Singh

Keyword(s):

Thermal Analysis ◽

Integrated Circuits ◽

Test Scheduling ◽

3D Integrated Circuits

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Thermal-aware test scheduling for NOC-based 3D integrated circuits

2013 IFIP/IEEE 21st International Conference on Very Large Scale Integration (VLSI-SoC) ◽

10.1109/vlsi-soc.2013.6673257 ◽

2013 ◽

Author(s):

Dong Xiang ◽

Gang Liu ◽

Krishnendu Chakrabarty ◽

Hideo Fujiwara

Keyword(s):

Integrated Circuits ◽

Test Scheduling ◽

3D Integrated Circuits

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Thermal analysis of 3D integrated circuits based on discontinuous Galerkin finite element method

Thirteenth International Symposium on Quality Electronic Design (ISQED) ◽

10.1109/isqed.2012.6187483 ◽

2012 ◽

Author(s):

Amir Zjajo ◽

Nick van der Meijs ◽

Rene van Leuken

Keyword(s):

Finite Element Method ◽

Thermal Analysis ◽

Finite Element ◽

Integrated Circuits ◽

Discontinuous Galerkin ◽

Galerkin Finite Element Method ◽

Galerkin Finite Element ◽

Discontinuous Galerkin Finite Element ◽

3D Integrated Circuits ◽

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Test scheduling using Ant Colony Optimization for 3D integrated circuits

2013 International SoC Design Conference (ISOCC) ◽

10.1109/isocc.2013.6863973 ◽

2013 ◽

Author(s):

Inhyuk Choi ◽

Taewoo Han ◽

Sungho Kang

Keyword(s):

Integrated Circuits ◽

Ant Colony Optimization ◽

Test Scheduling ◽

3D Integrated Circuits

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Electro-Thermal Analysis of Integrated Circuits Using Coupling of SPICE and COMSOL

2018 International Conference on Signals and Electronic Systems (ICSES) ◽

10.1109/icses.2018.8507331 ◽

2018 ◽

Author(s):

Rajesh Michael ◽

Piotr Kocanda ◽

Ireneusz Brzozowski ◽

Andrej Kos

Keyword(s):

Thermal Analysis ◽

Integrated Circuits

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Thermal analysis of vertically integrated circuits

Proceedings of International Electron Devices Meeting ◽

10.1109/iedm.1995.499244 ◽

2002 ◽

Author(s):

M.B. Kleiner ◽

S.A. Kuhn ◽

P. Ramm ◽

W. Weber

Keyword(s):

Thermal Analysis ◽

Integrated Circuits

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Experimental investigation of electromigration failure in Cu–Sn–Cu micropads in 3D integrated circuits

Microelectronic Engineering ◽

10.1016/j.mee.2014.03.003 ◽

2014 ◽

Vol 122 ◽

pp. 46-51 ◽

Author(s):

Zhihong Huang ◽

Robert E. Jones ◽

Ankur Jain

Keyword(s):

Experimental Investigation ◽

Integrated Circuits ◽

3D Integrated Circuits

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Analysis of critical thermal issues in 3D integrated circuits

International Journal of Heat and Mass Transfer ◽

10.1016/j.ijheatmasstransfer.2016.02.010 ◽

2016 ◽

Vol 97 ◽

pp. 337-352 ◽

Author(s):

Fatemeh Tavakkoli ◽

Siavash Ebrahimi ◽

Shujuan Wang ◽

Kambiz Vafai

Keyword(s):

Integrated Circuits ◽

3D Integrated Circuits

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3D Integrated Circuits Layout Optimization Game

Artificial Intelligence and Soft Computing - Lecture Notes in Computer Science ◽

10.1007/978-3-319-59060-8_40 ◽

2017 ◽

pp. 444-453

Author(s):

Katarzyna Grzesiak-Kopeć ◽

Leszek Nowak ◽

Maciej Ogorzałek

Keyword(s):

Integrated Circuits ◽

Layout Optimization ◽

3D Integrated Circuits

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Exploration of the Thermal Design Space in 3D Integrated Circuits

Physical Design for 3D Integrated Circuits ◽

10.1201/b19225-11 ◽

2017 ◽

pp. 245-259

Author(s):

Sumeet S. Kumar ◽

Amir Zjajo ◽

Rene van Leuken

Keyword(s):

Integrated Circuits ◽

Design Space ◽

Thermal Design ◽

3D Integrated Circuits

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Electromigration Alleviation Techniques for 3D Integrated Circuits

High Performance Computing for Big Data ◽

10.1201/9781315155524-4 ◽

2017 ◽

pp. 37-58

Author(s):

Yuanqing Cheng ◽

Aida Todri-Sanial ◽

Alberto Bosio ◽

Luigi Dilillo ◽

Patrick Girard ◽

...

Keyword(s):

Integrated Circuits ◽

3D Integrated Circuits

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