Physical Design for 3D Integrated Circuits
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Published By CRC Press

9781315214306
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

3D Placement and Routing

2017 ◽  
pp. 83-100
Author(s):  
Pingqiang Zhou ◽  
Sachin S. Sapatnekar
Keyword(s):  
Placement And Routing

TSV-to-Device Noise Analysis and Mitigation Techniques

2017 ◽  
pp. 293-308
Author(s):  
Brad Gaynor ◽  
Nauman Khan ◽  
Soha Hassoun
Keyword(s):  
Noise Analysis ◽  
Mitigation Techniques ◽  
Device Noise

Exploration of the Thermal Design Space in 3D Integrated Circuits

2017 ◽  
pp. 245-259
Author(s):  
Sumeet S. Kumar ◽  
Amir Zjajo ◽  
Rene van Leuken
Keyword(s):  
Integrated Circuits ◽  
Design Space ◽  
Thermal Design ◽  
3D Integrated Circuits

2.5D/3D ICs

2017 ◽  
pp. 3-30
Author(s):  
Chuan Seng Tan
Keyword(s):  
3D Ics

Power and Signal Integrity Challenges in 3D Systems-on-Chip

2017 ◽  
pp. 101-126
Author(s):  
Emre Salman
Keyword(s):  
Signal Integrity ◽  
Systems On Chip ◽  
On Chip

3D Interconnect Extraction

2017 ◽  
pp. 53-79
Author(s):  
Sung Kyu Lim

Detailed Electrical and Reliability Study of Tapered TSVs

2017 ◽  
pp. 39-52
Author(s):  
Tiantao Lu ◽  
Ankur Srivastava
Keyword(s):  
Reliability Study

Live Free or Die Hard

2017 ◽  
pp. 193-227
Author(s):  
Yu-Guang Chen ◽  
Yiyu Shi ◽  
Shih-Chieh Chang

Challenges and Future Directions of 3D Physical Design

2017 ◽  
pp. 357-386
Author(s):  
Johann Knechtel ◽  
Jens Lienig ◽  
Cliff C.N. Sze
Keyword(s):  
Physical Design ◽  
Future Directions
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