2013 IEEE International 3D Systems Integration Conference (3DIC)
Latest Publications

TOTAL DOCUMENTS

87

(FIVE YEARS 0)

H-INDEX

9

(FIVE YEARS 0)

Published By IEEE

9781467364843

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

The monolithic 3D advantage: Monolithic 3D is far more than just an alternative to 0.7x scaling

2013 IEEE International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2013.6702316 ◽

2013 ◽

Author(s):

Zvi Or-Bach

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A novel circuit model for multiple Through Silicon Vias (TSVs) in 3D IC

2013 IEEE International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2013.6702389 ◽

2013 ◽

Author(s):

Yang Yi ◽

Yaping Zhou

Keyword(s):

Circuit Model ◽

3D Ic ◽

Through Silicon Vias ◽

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Highly efficient TSV repair technology for resilient 3-D stacked multicore processor system

2013 IEEE International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2013.6702338 ◽

2013 ◽

Author(s):

H. Hashimoto ◽

T. Fukushima ◽

K. W. Lee ◽

M. Koyanagi ◽

T. Tanaka

Keyword(s):

Multicore Processor ◽

Highly Efficient ◽

Repair Technology

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Layout dependent synthesis for manufacturing costs optimized 3D integrated systems

2013 IEEE International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2013.6702349 ◽

2013 ◽

Author(s):

Andy Heinig

Keyword(s):

Integrated Systems ◽

Manufacturing Costs

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Improving 3D-Floorplanning using smart selection operations in meta-heuristic optimization

2013 IEEE International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2013.6702337 ◽

2013 ◽

Author(s):

Artur Quiring ◽

Markus Olbrich ◽

Erich Barke

Keyword(s):

Heuristic Optimization

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A scalable multi-dimensional NoC simulation model for diverse spatio-temporal traffic patterns

2013 IEEE International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2013.6702365 ◽

2013 ◽

Author(s):

Awet Yemane Weldezion ◽

Matt Grange ◽

Dinesh Pamunuwa ◽

Axel Jantsch ◽

Hannu Tenhunen

Keyword(s):

Simulation Model ◽

Traffic Patterns ◽

Spatio Temporal

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A block-parallel ADC with digital noise cancelling for 3-D stacked CMOS image sensor

2013 IEEE International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2013.6702363 ◽

2013 ◽

Author(s):

K. Kiyoyama ◽

Y. Sato ◽

H. Hashimoto ◽

K-W Lee ◽

T. Fukushima ◽

...

Keyword(s):

Cmos Image Sensor ◽

Image Sensor ◽

Noise Cancelling

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Device physics aware 3D electromagnetic simulation of Through-Silicon-Vias in system modeling

2013 IEEE International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2013.6702340 ◽

2013 ◽

Author(s):

D. Gope ◽

S. Chatterjee ◽

D. de Araujo ◽

S. Chakraborty ◽

J. Pingenot ◽

...

Keyword(s):

System Modeling ◽

Electromagnetic Simulation ◽

Device Physics ◽

Through Silicon Vias ◽

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Active pixel sensors with enhanced pixel-level analog and digital functionalities in a 2-tier 3D CMOS technology

2013 IEEE International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2013.6702333 ◽

2013 ◽

Author(s):

Valerio Re ◽

Massimo Manghisoni ◽

Gianluca Traversi ◽

Luigi Gaioni ◽

Alessia Manazza ◽

...

Keyword(s):

Cmos Technology ◽

Active Pixel Sensors ◽

Active Pixel ◽

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Thermo-mechanical study of a 2.5D passive silicon interposer technology: Experimental, numerical and In-Situ stress sensors developments

2013 IEEE International 3D Systems Integration Conference (3DIC) ◽

10.1109/3dic.2013.6702332 ◽

2013 ◽

Author(s):

Benjamin Vianne ◽

Pierre Bar ◽

Vincent Fiori ◽

Sebastien Petitdidier ◽

Norbert Chevrier ◽

...

Keyword(s):

In Situ Stress ◽

Stress Sensors ◽

Mechanical Study

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