Efficient Mapping of Graphic Software on DSP

Author(s):  
Mihir Mody ◽  
Ajay Jayaraj ◽  
Hemant Hariyani ◽  
Anand Balagopalakrishnan ◽  
Jason Jones ◽  
...  
Keyword(s):  
1977 ◽  
Vol 11 (3) ◽  
pp. 1-117 ◽  
Author(s):  
Compuater Graphics staff

1989 ◽  
Vol 101 (5) ◽  
pp. 522-526 ◽  
Author(s):  
Charles Lutz ◽  
Akira Takagi ◽  
Ivo P. Janecka ◽  
Isamu Sando

The complexities of the temporal bone and the critical inter-relationships among its key structures can be simplified with three-dimensional computer-assisted reconstruction. Knowledge of the topography of these structures and their mutual relationships in essential in any surgical approach to the temporal bone. Sixty sagittal histologic sections of a normal left temporal bone were examined. Each section, 30 μm in thickness, was optically enlarged. Segments representing the facial nerve, internal carotid artery, and inner ear structures from individual slides were traced and data were entered into a computer. A personal computer was used for data processing and analysis. Graphic software developed in our laboratory generated images with x-y-z coordinates that could be rotated In any plane. The high resolution of the computer graphics system, combined with the precision of histologic sections, permitted study of the critical three-dimensional anatomic relationships among essential intratemporal bone structures. The capability of reproducing individual and joint images of the intratemporal bone structures and viewing them from all surgical angles gives skull base and otologic surgeons Important topographic guidance. Accurate spatial measurements of temporal bone anatomy are now possible with the application of computer graphic technology.


2018 ◽  
Vol 14 (s1) ◽  
pp. 1-9
Author(s):  
Bodor Péter ◽  
Baranyai László ◽  
Szekszárdi Andrea ◽  
Bisztray György Dénes ◽  
Bálo Borbála

Leaf morphology of the grapevine (Vitis vinifera L.) cv. ‘Kövidinka’ was evaluated based on 32 landmarks. The aim of this study was to reveal leaf morphological diversity along the shoot axis. For this purpose 10 shoots were collected with 26 to 35 leaves. Altogether 304 leaf samples were digitised and analysed with the GRA.LE.D 2.04. raster graphic software. Leaf damage was estimated based on the missing landmarks on the lamina. Our results showed that the leaves on the 11th and 13th nodes are the most intact, without missing landmarks. Lowest variability (cv = 0,126) of the investigated 54 morphological characteristics were observed among the leaves on the 11th nodes of the shoots, in accordance with the literature. Based on the results length of the veins, angles between the veins and further features such as size of the serrations show high diversity along the shoot axis. These results underline the need of careful sampling during the ampelometric investigations.


2016 ◽  
Vol 33 (2) ◽  
pp. 94-101
Author(s):  
Kamil Janeczek ◽  
Aneta Arazna ◽  
Konrad Futera ◽  
Grazyna Koziol

Purpose The aim of this paper is to present non-destructive and destructive methods of failure analysis of epoxy moulded IC packages on the example of power MOSFETs in SOT-227 package. Design/methodology/approach A power MOSFET in SOT-227 package was examined twice using X-ray inspection, at first as the whole component to check if it is damaged and then after removing the upper part of package by mechanical grinding. The purpose of the second X-ray inspection was to prepare images for estimation of the total number and approximate location of voids in soft solder layers. Finally, power MOSFETs were subjected to decapsulation process using a concentrated sulphuric acid to verify existence of damage areas noticed during X-ray analysis and to observe other possible failures such as cracks in aluminium metallization or wires deformation. Findings X-ray analysis was revealed to be adequate technique to detect damage (e.g. meltings) in power MOSFETs in SOT-227 package, but only when tested components were analysed in the side view. This type of analysis combined with a graphic software is also suitable for voids estimation in soft solder layers. Moreover, it was found that a single acid (concentrated sulphuric acid) at elevated temperature can be successfully used for decapsulation of power MOSFETs in SOT-227 package without damage of aluminium metallization and aluminium wires. Such decapsulation process enables analysis of defects in wire, die and package materials. Research limitations/implications Further investigations are required to examine if the presented methods of failures analysis can be used for other types of components (e.g. high power resistors) in similar packages. Practical/implications The described methods of failure analysis can find application in electronic industry to select components which are free of damage and in effect which allow to produce high reliable devices. Apart from it, the presented method is applicable to evaluate reasons of improper work of tested electronic devices and to identify faked components. Originality/value This paper contains valuable information for research and technical staff involved in the assessment of electronic devices who needs practical methods of failure analysis of epoxy moulded IC packages.


1990 ◽  
Vol 8 (2) ◽  
pp. 108-110 ◽  
Author(s):  
A. Thomas ◽  
M.C. Vaney ◽  
M. Le Bars ◽  
J.P. Mornon ◽  
I. Morize

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