Interfacial Characteristics and Mechanical Properties of Cu/Ga/Cu Interconnects by Transient Liquid Phase Bonding
2008 ◽
Vol 24
(12)
◽
pp. 1492-1500
◽
2016 ◽
Vol 27
(5)
◽
pp. 4839-4848
◽
2019 ◽
Vol 147
◽
pp. 116-126
◽
2000 ◽
Vol 18
(1)
◽
pp. 133-140
◽
2018 ◽
Vol 29
(12)
◽
pp. 10246-10257
◽
2008 ◽
Vol 24
(5)
◽
pp. 517-528
◽
1997 ◽
Vol 15
(1)
◽
pp. 108-114
◽
2016 ◽
Vol 32
(11)
◽
pp. 1137-1151
◽
2017 ◽
Vol 25
◽
pp. 172-180
◽