Passive structures for working frequencies at 60 GHz open up new dimensions for wireless broadband applications. The bandwidth available allows even faster data transfer. Thanks to the technology development and RF characterization of low-sintering glass-ceramics, 3D structures and low-cost production will be achievable. A detailed description of the design and the manufacturing of planar galvanically coupled and planar field coupled passive baluns, such as Marchand baluns, is given in this paper. Baluns are mostly built up with partly lumped elements, which are realized as embedded passives. This is currently not possible at the 60-GHz–range in thick-film technology. Electromagnetic 3D FEM simulations are therefore carried out in order to optimize and analyze baluns at 60 GHz. Several types of baluns were produced in low-temperature co-fired ceramic (LTCC). Due to the required pattern resolution (line width, 60 μm; minimum gap, 40 μm) a fine-line screen printing process as well as micro via punching (70 μm) are necessary. Printing tolerances and process-related dimensional stability are evaluated. In addition, material properties, such as permittivity, are investigated up to 67 GHz. With the help of asymmetrical test equipment, cascaded baluns in series are characterized. A symmetrical MMIC amplifier was mounted via flip-chip in order to demonstrate its performance in real applications. Gold-stud-bumping is used for this purpose. The stud bumps, which are 60 μm in diameter, were placed in a pitch of 100 μm.