MCG: a correct-by-design multichip module router with crosstalk avoidance

Proceedings Seventh IEEE International Workshop on Rapid System Prototyping. Shortening the Path from Specification to Prototype ◽

10.1109/iwrsp.1996.506804 ◽

2002 ◽

Author(s):

J.D. Carothers ◽

Donghui Li ◽

T. Hameenanttila

Keyword(s):

Multichip Module ◽

Crosstalk Avoidance

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Fast coupled noise estimation for crosstalk avoidance in the MCG multichip module autorouter

IEEE Transactions on Very Large Scale Integration (VLSI) Systems ◽

10.1109/92.532036 ◽

1996 ◽

Vol 4 (3) ◽

pp. 356-368 ◽

Author(s):

T. Hameenanttila ◽

J.D. Carothers ◽

Donghui Li

Keyword(s):

Noise Estimation ◽

Multichip Module ◽

Crosstalk Avoidance

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Multichip Module High Speed Testing

10.21236/ada274873 ◽

1993 ◽

Author(s):

Robert J. Davis ◽

David H. Auston

Keyword(s):

Multichip Module

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Optical Interconnect Technology (OIT) Multichip Module to Multichip Module

10.21236/ada362637 ◽

1998 ◽

Author(s):

Julian Bristow ◽

Yue Liu ◽

Klein Johnson

Keyword(s):

Optical Interconnect ◽

Multichip Module ◽

Interconnect Technology

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Bus partitioning technique with crosstalk avoidance code

2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) ◽

10.1109/icsict.2016.7998790 ◽

2016 ◽

Author(s):

Yang Hu ◽

Xiaole Cui ◽

Yalin Ran ◽

Mengying Luo ◽

Jiantong Jiang ◽

...

Keyword(s):

Partitioning Technique ◽

Crosstalk Avoidance

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Integrated micro heat sink for power multichip module

Conference Record of 1998 IEEE Industry Applications Conference. Thirty-Third IAS Annual Meeting (Cat. No.98CH36242) ◽

10.1109/ias.1998.730275 ◽

2002 ◽

Author(s):

C. Gillot ◽

C. Schaeffer ◽

A. Bricard

Keyword(s):

Heat Sink ◽

Multichip Module

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Development of three-dimensional multichip module based on embedded substrate with multiple interconnections

2008 International Conference on Electronic Packaging Technology & High Density Packaging ◽

10.1109/icept.2008.4606955 ◽

2008 ◽

Author(s):

Gaowei Xu ◽

Yanhong Wu ◽

Fei Geng ◽

Qiuping Huang ◽

Jian Zhou ◽

...

Keyword(s):

Three Dimensional ◽

Multichip Module

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Thermal design for high-speed high-density multichip module

IEEE Transactions on Components Hybrids and Manufacturing Technology ◽

10.1109/33.237932 ◽

1993 ◽

Vol 16 (4) ◽

pp. 384-387 ◽

Author(s):

T. Handa ◽

S. Iida ◽

J. Utsunomiya

Keyword(s):

High Density ◽

Thermal Design ◽

Multichip Module

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A computer-aided tool for multichip module package design

Proceedings of 1994 International Conference on Wafer Scale Integration (ICWSI) ◽

10.1109/icwsi.1994.291260 ◽

2002 ◽

Author(s):

P. Katragadda ◽

S. Bhattacharya ◽

I.R. Grosse

Keyword(s):

Multichip Module ◽

Package Design ◽

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Error-correction and crosstalk avoidance in DSM busses

IEEE Transactions on Very Large Scale Integration (VLSI) Systems ◽

10.1109/tvlsi.2004.827565 ◽

2004 ◽

Vol 12 (10) ◽

pp. 1076-1080 ◽

Author(s):

K.N. Patel ◽

I.L. Markov

Keyword(s):

Error Correction ◽

Crosstalk Avoidance

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Thermal design and reliability of convenable MultiChip Module package on HDIIVH substrates

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. ◽

10.1109/emap.2002.1188876 ◽

2003 ◽

Author(s):

Hsiang-Chen Hsu ◽

Lih-Shan Chen ◽

Lee-Wei Chu

Keyword(s):

Thermal Design ◽

Multichip Module

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