Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002.
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Reliability of the SnBi lead finished Pb-free produet

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. ◽

10.1109/emap.2002.1188829 ◽

2005 ◽

Author(s):

Ki-Hwan Park ◽

Nam-Seog Kim ◽

Se-Yong Oh

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Board-level reliability of lead-free SnAgCu solder joint

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. ◽

10.1109/emap.2002.1188851 ◽

2003 ◽

Author(s):

Jian-Shu Wu ◽

Shan-Pu Yu ◽

I-Hsuan Peng ◽

Jong-Lih Wang ◽

B. Chung

Keyword(s):

Solder Joint ◽

Lead Free ◽

Snagcu Solder ◽

Board Level ◽

Board Level Reliability

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Effect of phosphorus content and solid state aging on intermetallic formation between lead-free Sn-Ag-Cu solder and electroless nickel/immersion gold under bump metallurgy

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. ◽

10.1109/emap.2002.1188848 ◽

2003 ◽

Author(s):

S.F. Tai ◽

A. Ourdjini ◽

Y.L. Khong ◽

V.C. Venkatesh ◽

M.N. Tamin

Keyword(s):

Solid State ◽

Phosphorus Content ◽

Electroless Nickel ◽

Lead Free ◽

Intermetallic Formation ◽

Electroless Nickel Immersion Gold

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Thermal design and reliability of convenable MultiChip Module package on HDIIVH substrates

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. ◽

10.1109/emap.2002.1188876 ◽

2003 ◽

Author(s):

Hsiang-Chen Hsu ◽

Lih-Shan Chen ◽

Lee-Wei Chu

Keyword(s):

Thermal Design ◽

Multichip Module

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Thin GaAs film on GaAs/Si substrate

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. ◽

10.1109/emap.2002.1188867 ◽

2003 ◽

Author(s):

Yung Sheng Chang ◽

Chih Yuan Huang

Keyword(s):

Gaas Film ◽

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A study on the adhesion performance of copper to polyimide for microelectronic packaging-flex substrates

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. ◽

10.1109/emap.2002.1188835 ◽

2003 ◽

Author(s):

Yung-Sen Lin ◽

Huang-Ming Liu

Keyword(s):

Microelectronic Packaging ◽

Adhesion Performance

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Characterisation of crystallisation behaviour of electroless Ni-P plating during heating

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. ◽

10.1109/emap.2002.1188881 ◽

2003 ◽

Author(s):

Z. Guo ◽

K.G. Keong ◽

W. Sha

Keyword(s):

Crystallisation Behaviour ◽

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Current-mode BIST structure for mixed-signal circuits

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. ◽

10.1109/emap.2002.1188839 ◽

2003 ◽

Author(s):

Chun-Lung Hsu ◽

Keh-Chang Huang

Keyword(s):

Current Mode ◽

Mixed Signal ◽

Mixed Signal Circuits

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Time and temperature dependent mechanical characterization of polymer-based materials in electronic packaging application

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. ◽

10.1109/emap.2002.1188836 ◽

2003 ◽

Author(s):

Chia-Tai Kuo ◽

Ming-Chuen Yip ◽

Kuo-Ning Chiang ◽

Yi-Ming Jen

Keyword(s):

Electronic Packaging ◽

Mechanical Characterization ◽

Temperature Dependent

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Wire bondability of Au/Ni bond pads: effects of metallisation schemes and processing conditions

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. ◽

10.1109/emap.2002.1188815 ◽

2003 ◽

Author(s):

Yu Hin Chan ◽

Jang-kyo Kim ◽

D. Liu ◽

C.K. Liu ◽

Yiu Ming Cheung ◽

...

Keyword(s):

Processing Conditions ◽

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