A 3 Megapixel 100 Fps 2.8 $\mu$m Pixel Pitch CMOS Image Sensor Layer With Built-in Self-Test for 3D Integrated Imagers

2013 ◽  
Vol 48 (3) ◽  
pp. 839-849 ◽  
Author(s):  
Shang-Fu Yeh ◽  
Chih-Cheng Hsieh ◽  
Ka-Yi Yeh
2019 ◽  
Vol 58 (SB) ◽  
pp. SBBL02
Author(s):  
Masahiro Kobayashi ◽  
Hiroshi Sekine ◽  
Takafumi Miki ◽  
Takashi Muto ◽  
Toshiki Tsuboi ◽  
...  

Sensors ◽  
2017 ◽  
Vol 17 (12) ◽  
pp. 2860 ◽  
Author(s):  
Hiroshi Sekine ◽  
Masahiro Kobayashi ◽  
Yusuke Onuki ◽  
Kazunari Kawabata ◽  
Toshiki Tsuboi ◽  
...  

2018 ◽  
Vol 53 (11) ◽  
pp. 3017-3025 ◽  
Author(s):  
Masaki Sakakibara ◽  
Koji Ogawa ◽  
Shin Sakai ◽  
Yasuhisa Tochigi ◽  
Katsumi Honda ◽  
...  

2004 ◽  
Vol 39 (12) ◽  
pp. 2417-2425 ◽  
Author(s):  
H. Takahashi ◽  
M. Kinoshita ◽  
K. Morita ◽  
T. Shirai ◽  
T. Sato ◽  
...  

Sensors ◽  
2019 ◽  
Vol 19 (7) ◽  
pp. 1505 ◽  
Author(s):  
Woo-Tae Kim ◽  
Cheonwi Park ◽  
Hyunkeun Lee ◽  
Ilseop Lee ◽  
Byung-Geun Lee

This paper presents a high full well capacity (FWC) CMOS image sensor (CIS) for space applications. The proposed pixel design effectively increases the FWC without inducing overflow of photo-generated charge in a limited pixel area. An MOS capacitor is integrated in a pixel and accumulated charges in a photodiode are transferred to the in-pixel capacitor multiple times depending on the maximum incident light intensity. In addition, the modulation transfer function (MTF) and radiation damage effect on the pixel, which are especially important for space applications, are studied and analyzed through fabrication of the CIS. The CIS was fabricated using a 0.11 μm 1-poly 4-metal CIS process to demonstrate the proposed techniques and pixel design. A measured FWC of 103,448 electrons and MTF improvement of 300% are achieved with 6.5 μm pixel pitch.


Author(s):  
Tsukasa Miura ◽  
Masaki Sakakibara ◽  
Hirotsugu Takahashi ◽  
Tadayuki Taura ◽  
Keiji Tatani ◽  
...  

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