Thermal imaging: Just a note, not the whole tune a look into continuous thermal monitoring in switchear

Author(s):  
Shelly DeGrate ◽  
James Payne ◽  
Roy Belak
2020 ◽  
Vol S-I (2) ◽  
pp. 172-176
Author(s):  
A. Vlasov ◽  
◽  
N. Podobed ◽  
V. Podobed ◽  
◽  
...  

The article discusses the technique of thermal imaging diagnostics to prevent emergencies in electrical installations of offshore facilities: ships, floating offshore drilling rigs and floating ship repair docks. Some results of thermal imaging diagnostics of sea vessels are presented.


2009 ◽  
Vol 5 (1) ◽  
pp. 31-35
Author(s):  
F.F. Sizov ◽  
◽  
V.V. Zabudsky ◽  
A.G. Golenkov ◽  
S.L. Kravchenko ◽  
...  

2013 ◽  
Vol 133 (7) ◽  
pp. 274-279
Author(s):  
Tomoyuki Takahata ◽  
Kiyoshi Matsumoto ◽  
Isao Shimoyama

Science Scope ◽  
2016 ◽  
Vol 039 (07) ◽  
Author(s):  
Jeffrey Nordine ◽  
Susanne Wessnigk

2017 ◽  
Vol 16 (6) ◽  
pp. 1389-1393 ◽  
Author(s):  
Cristian Tomescu ◽  
Maria Prodan ◽  
Niculina Vatavu ◽  
Emeric Chiuzan

Author(s):  
Nova T. Zamora ◽  
Kam Meng Chong ◽  
Ashish Gupta

Abstract This paper presented the recent application of die powerup in Thermal Imaging as applied to the detection of defects causing thermal failure on revenue products or units not being captured using other available techniques. Simulating the condition on an actual computer setup, the infrared (IR) camera should capture images simultaneously as the entire bootup process is being executed by the processor, thus revealing a series of images and thermal information on each and every step of the startup process. This metrology gives the failure analyst a better approach to acquire a set of information that substantiate in the conduct of rootcause analysis of thermal-related failure in revenue units, especially on customer returns. Defective units were intentionally engineered in order to collect the thermal response data and eventually come up with a plot of all known thermal-related defects.


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