New contributions to compound semiconductor technology for RF MEMS applications

Author(s):  
H.L. Hartnagel ◽  
K. Mutamba
1991 ◽  
Vol 02 (03) ◽  
pp. 147-162 ◽  
Author(s):  
ROBERT G. SWARTZ

Compound semiconductor technology is rapidly entering the mainstream, and is quickly finding its way into consumer applications where high performance is paramount. But silicon integrated circuit technology is evolving up the performance curve, and CMOS in particular is consuming ever more market share. Nowhere is this contest more clearly evident than in optical communications. Here applications demand performance ranging from a few hundreds of megahertz to multi-gigahertz, from circuits containing anywhere from tens to tens of thousands of devices. This paper reviews the high performance electronics found in optical communication applications from a technology standpoint, illustrating merits and market trends for these competing, yet often complementary IC technologies.


Author(s):  
Mohamad H. El-Khatib ◽  
Arnaud Pothier ◽  
Pierre Blondy

Microwave coaxial switches used in satellites for instance are quite heavy and bulky and thus have an important after-effect on a payload cost. MEMS devices seems to bring a new alternative for compact switching matrix design which requires a large number of switching devices often incompatible with the semiconductor technology in term of dissipated power [3]. Meanwhile, the reliability of MEMS components for space applications still remains today a problem to be solved, in term of design, technology and cost of realization. Hence the component packaging appears today to be a crucial issue for these devices formed starting from mechanically deformable elements which require a stable environment, clean and deprived of moisture to function in an optimal way [1][2]. In spite of the strong integration of these components, standard packaging solutions are not appropriated for MEMS components [4]. This is why dedicated technological solutions must be developed to encapsulate the component or a group of components on the substrate by using simple techniques limited in term of technological steps.


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