Steady state and transient thermal analysis of hot spots in 3D stacked ICs using dedicated test chips
Keyword(s):
2018 ◽
Vol 46
(5)
◽
pp. 1422-1428
◽
Keyword(s):
Keyword(s):
Keyword(s):
Preliminary steady state and transient thermal analysis of the new HCPB blanket for EU DEMO reactor
2016 ◽
Vol 41
(17)
◽
pp. 7047-7052
◽
1999 ◽
Vol 09
(02)
◽
pp. 131-139
◽
2012 ◽
pp. 794-798
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