ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208)

Thermal management with additive multilayer circuitry on metal substrates

ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208) ◽

10.1109/itherm.1998.689616 ◽

2002 ◽

Cited By ~ 1

Author(s):

G. Matijasevic ◽

P. Gandhi ◽

C. Gallagher ◽

X. Xi ◽

L. Ha

Keyword(s):

Thermal Management ◽

Metal Substrates

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Design-based thermal simulation methodology for ball grid array packages

ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208) ◽

10.1109/itherm.1998.689523 ◽

2002 ◽

Cited By ~ 9

Author(s):

Z. Johnson ◽

M. Eyman

Keyword(s):

Ball Grid Array ◽

Thermal Simulation ◽

Simulation Methodology ◽

Ball Grid Array Packages

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The use of heat pipes in personal computers

ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208) ◽

10.1109/itherm.1998.689600 ◽

2002 ◽

Cited By ~ 16

Author(s):

H. Xie ◽

A. Ali ◽

R. Bhatia

Keyword(s):

Heat Pipes ◽

Personal Computers

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Single temperature calibration method for die level temperature sensors

ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208) ◽

10.1109/itherm.1998.689524 ◽

2002 ◽

Cited By ~ 6

Author(s):

G.L. Solbrekken ◽

C.-P. Chiu

Keyword(s):

Calibration Method ◽

Temperature Sensors ◽

Temperature Calibration ◽

Single Temperature

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Bayesian surrogates for integrating numerical, analytical and experimental data: application to inverse heat transfer in wearable computers

ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208) ◽

10.1109/itherm.1998.689520 ◽

2002 ◽

Author(s):

N. Leoni ◽

C. Amon

Keyword(s):

Heat Transfer ◽

Experimental Data ◽

Wearable Computers ◽

Inverse Heat Transfer ◽

Data Application

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Evaluating thermal characterization accuracy using CFD codes-a package level benchmark study of IcePak/sup TM/ and Flotherm/sup R/

ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208) ◽

10.1109/itherm.1998.689581 ◽

2002 ◽

Cited By ~ 8

Author(s):

B.A. Zahn

Keyword(s):

Thermal Characterization ◽

Benchmark Study

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Heat transfer from micro-finned and flat surfaces to flow of Fluorinert coolant; boiling heat transfer

ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208) ◽

10.1109/itherm.1998.689591 ◽

2002 ◽

Cited By ~ 2

Author(s):

H. Mizunuma ◽

M. Behnia ◽

W. Nakayama

Keyword(s):

Heat Transfer ◽

Boiling Heat Transfer ◽

Flat Surfaces

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Thermal analysis of portable electronic products

ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208) ◽

10.1109/itherm.1998.689506 ◽

2002 ◽

Cited By ~ 1

Author(s):

J.S. Galloway

Keyword(s):

Thermal Analysis ◽

Electronic Products

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On predicting the operational thermal resistance of electronic components

ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208) ◽

10.1109/itherm.1998.689608 ◽

2002 ◽

Cited By ~ 1

Author(s):

M. Davies ◽

R. Cole ◽

J. Lohan

Keyword(s):

Thermal Resistance ◽

Electronic Components

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Effect of material and geometry parameters on the thermo-mechanical reliability of flip-chip assemblies

ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208) ◽

10.1109/itherm.1998.689540 ◽

2002 ◽

Cited By ~ 17

Author(s):

S. Michaelides ◽

S.K. Sitaraman

Keyword(s):

Flip Chip ◽

Mechanical Reliability

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ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Thermal management with additive multilayer circuitry on metal substrates

Design-based thermal simulation methodology for ball grid array packages

The use of heat pipes in personal computers

Single temperature calibration method for die level temperature sensors

Bayesian surrogates for integrating numerical, analytical and experimental data: application to inverse heat transfer in wearable computers

Evaluating thermal characterization accuracy using CFD codes-a package level benchmark study of IcePak/sup TM/ and Flotherm/sup R/

Heat transfer from micro-finned and flat surfaces to flow of Fluorinert coolant; boiling heat transfer

Thermal analysis of portable electronic products

On predicting the operational thermal resistance of electronic components

Effect of material and geometry parameters on the thermo-mechanical reliability of flip-chip assemblies

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ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Thermal management with additive multilayer circuitry on metal substrates

Design-based thermal simulation methodology for ball grid array packages

The use of heat pipes in personal computers

Single temperature calibration method for die level temperature sensors

Bayesian surrogates for integrating numerical, analytical and experimental data: application to inverse heat transfer in wearable computers

Evaluating thermal characterization accuracy using CFD codes-a package level benchmark study of IcePak/sup TM/ and Flotherm/sup R/

Heat transfer from micro-finned and flat surfaces to flow of Fluorinert coolant; boiling heat transfer

Thermal analysis of portable electronic products

On predicting the operational thermal resistance of electronic components

Effect of material and geometry parameters on the thermo-mechanical reliability of flip-chip assemblies

ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208)
Latest Publications