Thermal aging effects on the moisture equilibrium curves of mineral and mixed oil-paper insulation systems

2015 ◽  
Vol 22 (2) ◽  
pp. 842-850 ◽  
Author(s):  
Ruijin Liao ◽  
Yuandi Lin ◽  
Pei Guo ◽  
Haibin Liu ◽  
Huanhuan Xia
Keyword(s):  
Thermal Aging ◽  
Aging Effects ◽  
Insulation Systems ◽  
Mixed Oil ◽  
Paper Insulation

scholarly journals Dual-Temperature Evaluation of a High-Temperature Insulation System for Liquid-Immersed Transformer

Energies ◽  
2018 ◽  
Vol 11 (8) ◽  
pp. 1957 ◽  
Author(s):  
Xiaojing Zhang ◽  
Lu Ren ◽  
Haichuan Yu ◽  
Yang Xu ◽  
Qingquan Lei ◽  
...  
Keyword(s):  
High Temperature ◽  
Thermal Aging ◽  
Thermal Calculation ◽  
Insulation System ◽  
Dielectric Parameters ◽  
Distribution Transformers ◽  
Aging Test ◽  
Insulation Systems ◽  
Paper Insulation ◽  
Natural Ester

A high-temperature oil–paper insulation system offers an opportunity to improve the overloading capability of distribution transformers facing seasonal load variation. A high-temperature electrical insulation system (EIS) was chosen due to thermal calculation based on a typical loading curve on the China Southern Power Grid. In order to evaluate candidate high-temperature insulation systems, Nomex® T910 (aramid-enhanced cellulose) immersed in FR3 (natural ester) was investigated by a dual-temperature thermal aging test compared with a conventional insulation system, Kraft paper impregnated with mineral oil. Throughout the thermal aging test, mechanical, chemical, and dielectric parameters of both paper and insulating oil were investigated in each aging cycle. The thermal aging results determined that the thermal class of the FR3-T910 insulation system meets the request of overloading transformer needs.

Design of a Reaction Protocol for Decoupling Sulfur Removal and Thermal Aging Effects during Desulfation of Pt−BaO/Al2O3Lean NOxTrap Catalysts

2007 ◽  
Vol 46 (9) ◽  
pp. 2735-2740 ◽  
Author(s):  
Do Heui Kim ◽  
Ya-Huei Chin ◽  
George Muntean ◽  
Aleksey Yezerets ◽  
Neal Currier ◽  
...  
Keyword(s):  
Thermal Aging ◽  
Sulfur Removal ◽  
Aging Effects

Effects of thermal aging on moisture equilibrium in oil-paper insulation

2018 ◽  
Vol 25 (6) ◽  
pp. 2340-2348 ◽  
Author(s):  
Dongyang Wang ◽  
Lijun Zhou ◽  
Xianlang Li ◽  
Yi Cui ◽  
Huize Li ◽  
...  
Keyword(s):  
Thermal Aging ◽  
Paper Insulation

Viscoplastic Constitutive Model for High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder After High-Temperature Prolonged Storage

2018 ◽  
Author(s):  
Pradeep Lall ◽  
Vikas Yadav ◽  
Jeff Suhling ◽  
David Locker
Keyword(s):  
Mechanical Properties ◽  
High Temperature ◽  
High Strain Rate ◽  
Strain Rate ◽  
Thermal Aging ◽  
High Strain ◽  
Uniaxial Tensile ◽  
Uniaxial Tensile Test ◽  
Aging Effects ◽  
Model Predictions

Electronics in automotive underhood and downhole drilling applications may be subjected to sustained operation at high temperature in addition to high strain-rate loads. SAC solders used for second level interconnects have been shown to experience degradation in high strain-rate mechanical properties under sustained exposure to high temperatures. Industry search for solutions for resisting the high-temperature degradation of SAC solders has focused on the addition of dopants to the alloy. In this study, a doped SAC solder called SAC-Q solder have been studied. The high strain rate mechanical properties of SAC-Q solder have been studied under elevated temperatures up to 200°C. Samples with thermal aging at 50°C for up to 6-months have been used for measurements in uniaxial tensile tests. Measurements for SAC-Q have been compared to SAC105 and SAC305 for identical test conditions and sample geometry. Data from the SAC-Q measurements has been fit to the Anand Viscoplasticity model. In order to assess the predictive power of the model, the computed Anand parameters have been used to simulate the uniaxial tensile test and the model predictions compared with experimental data. Model predictions show good correlation with experimental measurements. The presented approach extends the Anand Model to include thermal aging effects.

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