Viscoplastic Constitutive Model for High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder After High-Temperature Prolonged Storage

2018 ◽  
Author(s):  
Pradeep Lall ◽  
Vikas Yadav ◽  
Jeff Suhling ◽  
David Locker
Keyword(s):  
Mechanical Properties ◽  
High Temperature ◽  
High Strain Rate ◽  
Strain Rate ◽  
Thermal Aging ◽  
High Strain ◽  
Uniaxial Tensile ◽  
Uniaxial Tensile Test ◽  
Aging Effects ◽  
Model Predictions

Electronics in automotive underhood and downhole drilling applications may be subjected to sustained operation at high temperature in addition to high strain-rate loads. SAC solders used for second level interconnects have been shown to experience degradation in high strain-rate mechanical properties under sustained exposure to high temperatures. Industry search for solutions for resisting the high-temperature degradation of SAC solders has focused on the addition of dopants to the alloy. In this study, a doped SAC solder called SAC-Q solder have been studied. The high strain rate mechanical properties of SAC-Q solder have been studied under elevated temperatures up to 200°C. Samples with thermal aging at 50°C for up to 6-months have been used for measurements in uniaxial tensile tests. Measurements for SAC-Q have been compared to SAC105 and SAC305 for identical test conditions and sample geometry. Data from the SAC-Q measurements has been fit to the Anand Viscoplasticity model. In order to assess the predictive power of the model, the computed Anand parameters have been used to simulate the uniaxial tensile test and the model predictions compared with experimental data. Model predictions show good correlation with experimental measurements. The presented approach extends the Anand Model to include thermal aging effects.

High Strain Rate Low Temperature Properties for SAC-R After Exposure to Isothermal Aging

2020 ◽  
Author(s):  
Pradeep Lall ◽  
Mrinmoy Saha ◽  
Jeff Suhling ◽  
Ken Blecker
Keyword(s):  
Mechanical Properties ◽  
High Strain Rate ◽  
Strain Rate ◽  
Storage Temperature ◽  
High Strain ◽  
Uniaxial Tensile ◽  
Uniaxial Tensile Test ◽  
Aging Effects ◽  
Space Applications ◽  
Sac Solder

Abstract Electronic parts in military, automotive, avionics and space applications may be subjected to sustained operation at high temperature in addition to high strain-rate loads. Parts may be stored in non-climate-controlled enclosures prior to deployment. Earlier studies on undoped SAC alloys have shown that the material properties evolve after prolonged period of storage at even modest temperatures. In order to mitigate the aging effects, a number of alloy formulation have been proposed. Data of the mechanical properties of lead-free solder alloys which is used for interconnection in the electronic packaging at high strain rates and at high storage temperature is very essential for design optimization of electronic package sustainability at extreme temperature environment because the SAC solders have shown to have degradation in mechanical properties at prolonged exposure to storage temperature. Industries have come up with a solution to reduce the degradation using dopants in SAC solder. In this study, a doped SAC solder called SAC-R has been subjected to high strain rate testing after extended storage at temperature of 50°C for 1 month, 2 months and 3 months. Samples with no aging and aged samples for up to 3-months have been subjected to uniaxial tensile tests to measure the mechanical properties of SAC-R for High and Low operating temperature ranging from −65°C to +200°C. The material data has been used to compute the constants for the Anand Visco-Plasticity model. The ability of the model to represent the material constitutive behavior has been quantified by comparing the model predictions of the uniaxial tensile test with the experimental data.

Determination of High and Low Temperature High Strain Rate Mechanical Properties for SAC-R After Exposure to Isothermal Aging of 50°C Up To 8 Months

2021 ◽  
Author(s):  
Pradeep Lall ◽  
Mrinmoy Saha ◽  
Jeff Suhling ◽  
Ken Blecker
Keyword(s):  
Mechanical Properties ◽  
High Strain Rate ◽  
Strain Rate ◽  
Prolonged Exposure ◽  
High Strain ◽  
Uniaxial Tensile ◽  
Uniaxial Tensile Test ◽  
Aging Effects ◽  
Space Applications ◽  
Sac Solder

Abstract Electronic parts may be subjected to continuous activity at high temperatures as well as high strain-rate loads in the oil exploration industry, military, automotive, avionics, and space applications, and parts may be stored in non-climate-controlled enclosures prior to deployment. Material properties evolve at even moderate temperatures after a long period of storage, according to previous studies on undoped SAC alloys. To reduce the aging effects, a number of alloy formulations have been proposed. Data on the mechanical properties of lead-free solder alloys used for interconnection in electronic packaging at high strain rates and high storage temperatures is very important for design optimization of electronic package sustainability at extreme temperatures, since SAC soldiers have shown degradation of mechanical properties after prolonged exposure to storage temperature. The use of dopants in SAC solder has been proposed as a solution to minimize degradation. In this study, After keeping the samples in storage at 50°C for 1–8 months, a doped SAC solder called SAC-R (Ecolloy) was subjected to high strain rate testing. Uniaxial impact hammer tensile tests were conducted on samples with no aging and samples that had been aged for up to 8 months to assess the mechanical properties of SAC-R at high and low operating temperatures ranging from −65°C to 200°C and the Mechanical properties has been compared with an undoped solder SAC 105. The constants for the Anand Visco-Plasticity model were calculated using the material data for SAC-R. By comparing model predictions of the uniaxial tensile test with experimental results, the model’s ability to reflect material constitutive behavior has been quantified.

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