Low temperature plasma amorphous carbon encapsulation for reliable multilevel interconnections-with applications to wafer scale multichip packaging
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1994 ◽
Vol 3
(1-2)
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pp. 83-87
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2016 ◽
Vol 304
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pp. 142-149
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2017 ◽
Vol 29
(4)
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pp. 1587-1598
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1997 ◽
Vol 117
(10)
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pp. 1262-1268
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High Temperature Material Processes An International Quarterly of High-Technology Plasma Processes
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2006 ◽
Vol 10
(3)
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pp. 457-466
2017 ◽
2019 ◽
Vol 23
(3)
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pp. 746-754
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