Displacement Measurement Through Digital Image Correlation and Digital Speckle Pattern Interferometry Techniques in Cold-Expanded Holes

Strain ◽  
2010 ◽  
Vol 46 (6) ◽  
pp. 581-588 ◽  
Author(s):  
A. Cirello ◽  
S. Pasta
2006 ◽  
Vol 326-328 ◽  
pp. 99-102 ◽  
Author(s):  
Fu Jun Yang ◽  
Xiao Yuan He

Digital image correlation method (DICM) is described as a robust in-plane deformation measuring method due to its simple optical setup and the insensitivity against ambient noise. Based on DICM, digital speckle projection has been developed for shape measurement. This paper explores the possibilities for vibration analysis using digital speckle projection together with DICM. A digital speckle pattern, generated by computer, is projected on an object surface using an LCD projector. Then the dynamic deformation modulated speckle images are captured by a high-speed CCD camera and saved in the computer. By using the self-developed temporal sequence digital images correlation algorithm, the deformation and vibration mode can be analyzed quantitatively. The proposed method avoids using stroboscopic or laser illumination and simplifies the experimental setup for vibration measurement, while it is time-consuming thanks to calculating a large amount of correlation coefficients. The experimental performance on a harmonic-vibrating cantilever beam well demonstrates the validity of the new method.


2013 ◽  
Vol 677 ◽  
pp. 406-411 ◽  
Author(s):  
Xing Hua Chai ◽  
Xiao Ping Lou ◽  
Nai Guang Lv

This paper refers to two whole-field , non-contact experimental techniques:Digital Speckle Pattern Interferometry (DSPI) and Digital Image Correlation (DIC). The former can measure 3-D deformations in nanometric level. The latter can measure small displacement in micrometric level. DSPI needs a phase-shifting setup and rotating the whole device for 3-D deformation measurement. Two CCD cameras will be required recording speckle image simultaneously for 3-D measurement by DIC method. An optical system which is a combination of the two measurement method is proposed in this paper. Digital image correlation setup using one CCD camera for in-plane measurement and digital speckle pattern interferometric setup for out-plane measurement constitutes this measurement system. Three dimensions information of deformation can be recorded simultaneously by one 3-color CCD camera. This system can be used to measure deformation with a small out-plane component and a relatively larger in-plane component.


2016 ◽  
Vol 48 ◽  
pp. 04003 ◽  
Author(s):  
Fedor Gubarev ◽  
Lin Li ◽  
Miron Klenovskii ◽  
Anatoliy Glotov

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