Three-Dimensional Stress Fields of Elastic Interface Cracks

1991 ◽  
Vol 58 (4) ◽  
pp. 939-946 ◽  
Author(s):  
T. Nakamura

Various aspects of stress fields near an interface crack in three-dimensional bimaterial plates are investigated. Due to the nature of the resulting deformation field, three-dimensional effects are more critical in a bimaterial plate than in a homogeneous plate. In the close vicinity of the crack front, the stress field is characterized by the asymptotic bimaterial K-field, and its domain size is a very small fraction of a plate thickness. Unlike a homogeneous case, the asymptotic field always consists all three modes of fracture, and an interface crack must propagate under mixed-mode conditions. Furthermore, computational results have shown that the two phase angles representing the relative magnitudes of the three modes strongly depend on the bimaterial properties. It has been also observed that a significant antiplane (Mode III) deformation exists along the crack front, especially near the free surface. Since experimental investigations have shown that critical energy release rate Gc is highly dependent on the phase angles, accurate prediction of the interface fracture behavior requires not only the G distribution but also the variations of phase angles along the crack front.

2006 ◽  
Vol 22 (2) ◽  
pp. 148-155 ◽  
Author(s):  
Junhua Zhao ◽  
Wanlin Guo ◽  
Chongmin She ◽  
Bo Meng

2014 ◽  
Vol 627 ◽  
pp. 225-228 ◽  
Author(s):  
Alex Møberg ◽  
Michal K. Budzik ◽  
Henrik M. Jensen

Delamination in layered materials is analyzed in a fracture mechanical framework. The work deals with quasi-static propagation of crack fronts along planar interfaces between different isotropic, elastic layers. Special focus is here on local effects at the sides of the layers which are assumed to be stress free. The interface crack front meets the free sides of the specimen at an angle which depends on the elastic mismatch in the system. Finite element calculations allowing the shape of the crack front to be arbitrary are carried out for double cantilever beam type specimens. An iterative procedure is formulated which adjusts the shape of the crack front so that an interface fracture criterion is satisfied locally along the front. Apart from the overall shape of the crack front, the angle of intersection with the free sides is in particular determined numerically by this procedure. Comparisons with analytical formulations and experimental results are performed.


1988 ◽  
Vol 130 ◽  
Author(s):  
John W. Hutchinson

AbstractThe mechanics of interface cracks has recently been clarified (e.g., [1]) and a number of efforts are underway to develop a mechanics of interface fracture with applications to composite materials, thin film/substrate systems, and coatings. An intrinsic feature of interfacial fracture is its mixed mode character wherein both shear and normal stresses act on the interface directly ahead of the crack. Depending on geometry and loading, the mixture of modes can range from purely normal stresses (mode I) to purely shear stresses (mode II). Toughness of an interface is characterized by critical combinations of mode I and mode II stress intensity factors (i.e., a locus of critical combinations) rather than just the single critical mode I stress intensity factor in the fracture of homogeneous materials. Equivalently, the critical energy release rate depends on the mode combination for interfacial fracture. Solutions are now available to the following problems: an interface crack in a layered structure where a very thin layer is sandwiched between two thick layers of different material [2], an interface crack between two layers of arbitrary thickness subject to arbitrary combinations of bending and stretching loads [3], and a crack in a substrate paralleling an interface between a thin film and the substrate driven by a variety of loadings including residual tension in the film [4]. These solutions can be used to analyze specimens for determining interfacial toughness and for predicting cracking in thin film or layered structures.


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