Thermal Mechanical Fatigue and Creep Interaction in Turbine Housing Divider Wall Design

Author(s):  
Wei Guo ◽  
Henry Guo

Turbochargers are commonly used to boost internal combustion engines for both on and off high way applications to meet current emission regulations and performance requirements. Divider wall turbochargers have two exhaust gas inlets and twin scrolls with the divider cast wall connected. Turbochargers with divider wall feature could conserve an engine’s exhaust pulse kinetic energy for great turbine wheel efficiency. It is widely used in 6-cylinder engine applications. Turbochargers with divider wall configuration operate in very hostile conditions with high temperature and great thermal gradient. Using thinner divider wall feature benefits aerodynamic performance, but with the configuration turbine housing may show cracks and large deformation during thermal cycling. In order to achieve the balance between mechanic and aerodynamic, design study of a reasonable divider wall is required. This paper first presents the initial design with thinner divider wall, which experienced severe cracking problem in the divider wall location during the engine thermal shock testing. In order to capture the failure mode at divider wall region, finite element analysis (FEA) with thermal mechanical fatigue (TMF) and creep interaction is performed. The simulation repeats the failure mode very well which shows this numerical analysis method is convincing and fast for further study. Base on the failure case and successful cases, TMF with creep interaction simulation criteria is proposed. The criteria could be used as the reference for the further design, and the design should be controlled within the criteria limit. Based on the methodology and the criteria, the new design is analyzed and the simulation result shows the risk is low. Engine thermal shock testing is done for the final validation. This design has acceptable cracks and no large deformation at divider wall location under the testing condition. TMF and creep interaction gives a right and fast methodology to capture the failure mode at divider wall. Meanwhile it provides a knowledge base for the turbine housing divider wall design.

2013 ◽  
Vol 331 ◽  
pp. 79-83 ◽  
Author(s):  
Zhong Bing Chen ◽  
Ming Sheng Chi ◽  
Li Feng Zheng ◽  
Ji Xiong Shen ◽  
Heng Hai Lei

With macrographic examination, SEM observation and fracture quantitative analysis technology, the fracture fractography of a spray tube with both the mechanical stress and the thermal stress in a boiler desuperheater of a power plant was interpreted, and the failure mode and the cause were researched. Results showed that rupture of the spray tube was due to the fatigue, and further, the thermal mechanical fatigue. The alternating bending stress and thermal stress were main factors of the fracture failure. The shallow surface thermal fatigue cracks in tube inner wall were induced by thermal stress. When the thermal mechanical fatigue crack grew up steadily to the shallow surface cracks zone, fast growth occurred and the local fast fracture zone generated which had different fractographies with final fast fracture zone of the normal fatigue fracture.


2015 ◽  
Vol 30 (12) ◽  
pp. 1261
Author(s):  
ZHANG Xiao-Feng ◽  
ZHOU Ke-Song ◽  
ZHANG Ji-Fu ◽  
ZHANG Yong ◽  
LIU Min ◽  
...  

Carbon ◽  
1982 ◽  
Vol 20 (2) ◽  
pp. 156
Author(s):  
S. Sato ◽  
K. Kawamata ◽  
J. Aizawa ◽  
M. Ishii

2006 ◽  
Vol 15-17 ◽  
pp. 633-638 ◽  
Author(s):  
Jong Woong Kim ◽  
Hyun Suk Chun ◽  
Sang Su Ha ◽  
Jong Hyuck Chae ◽  
Jin Ho Joo ◽  
...  

Board-level reliability of conventional Sn-37Pb and Pb-free Sn-3.0Ag-0.5Cu solder joints was evaluated using thermal shock testing. In the microstructural investigation of the solder joints, the formation of Cu6Sn5 intermetallic compound (IMC) layer was observed between both solders and Cu lead frame, but any crack or newly introduced defect cannot be found even after 2000 cycles of thermal shocks. Shear test of the multi layer ceramic capacitor (MLCC) joints were also conducted to investigate the effect of microstructural variations on the bonding strength of the solder joints. Shear forces of the both solder joints decreased with increasing thermal shock cycles. The reason to the decrease in shear force was discussed with fracture surfaces of the shear tested solder joints.


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