The application of the wheel used in super-high speed point (SHSP) grinding is introduced in detail, depicting the applied rang of the wheel, through designing the wheel body and the layer of CBN in the wheel. The designed principle is inferred according to the specific shape, the grinding productivity is analyzed in the course grinding zone and the finished grinding zone, introducing the angle of course grinding zone, which affects the grinding parameters in SHSP grinding, the value of the angle is designed to be suited to the point grinding, and manufacturing the wheel, introducing the changed state of chip flowing grinding used in the new wheel, the micro-surface of the wheel is observed through microscope, whose the ratio of air hole and the layer of CBN are analyzed, simulating the wear trend of the new wheel, the conclusions about super hard abrasives and wearing are drawn at last, the application of SHSP grinding is related to designing and manufacturing of the wheel, which provides the equipment for realizing high precision and productivity processing and offers the referred basis for the theoretical research.
Fast SD-Hamming Decoding in FPGA for High-Speed Concatenated FEC for Optical Communication
