Acoustic sensor module design and fabrication process

2002 ◽  
Vol 111 (6) ◽  
pp. 2527
Author(s):  
Eric Lee Goldner ◽  
Joseph Scott Salinas
2021 ◽  
Vol 7 (7) ◽  
pp. eabe5683
Author(s):  
Hee Seung Wang ◽  
Seong Kwang Hong ◽  
Jae Hyun Han ◽  
Young Hoon Jung ◽  
Hyun Kyu Jeong ◽  
...  

Flexible resonant acoustic sensors have attracted substantial attention as an essential component for intuitive human-machine interaction (HMI) in the future voice user interface (VUI). Several researches have been reported by mimicking the basilar membrane but still have dimensional drawback due to limitation of controlling a multifrequency band and broadening resonant spectrum for full-cover phonetic frequencies. Here, highly sensitive piezoelectric mobile acoustic sensor (PMAS) is demonstrated by exploiting an ultrathin membrane for biomimetic frequency band control. Simulation results prove that resonant bandwidth of a piezoelectric film can be broadened by adopting a lead-zirconate-titanate (PZT) membrane on the ultrathin polymer to cover the entire voice spectrum. Machine learning–based biometric authentication is demonstrated by the integrated acoustic sensor module with an algorithm processor and customized Android app. Last, exceptional error rate reduction in speaker identification is achieved by a PMAS module with a small amount of training data, compared to a conventional microelectromechanical system microphone.


2014 ◽  
Vol 644-650 ◽  
pp. 3686-3689
Author(s):  
Jin Wu Ju

The wireless sensor module is the thing networking technology first floor technology base, the wireless sensor module uses the battery power supply generally, this requests it to have the low power loss characteristic, requests when generally the work long must amount to for several thousand hours.This article introduced in the wireless sensor module design process, in view of its low power loss request, the technology which uses in the software design.


Sensor Review ◽  
2003 ◽  
Vol 23 (2) ◽  
Author(s):  
Jon Rigelsford

2021 ◽  
Vol 70 (12) ◽  
pp. 2029-2034
Author(s):  
Hyo-Seok Oh ◽  
Yong-Eun Choi ◽  
Young-Hyok Ji ◽  
Jae-Moon Kim

Author(s):  
M.G. Rosenfield

Minimum feature sizes in experimental integrated circuits are approaching 0.5 μm and below. During the fabrication process it is usually necessary to be able to non-destructively measure the critical dimensions in resist and after the various process steps. This can be accomplished using the low voltage SEM. Submicron linewidth measurement is typically done by manually measuring the SEM micrographs. Since it is desirable to make as many measurements as possible in the shortest period of time, it is important that this technique be automated.Linewidth measurement using the scanning electron microscope is not well understood. The basic intent is to measure the size of a structure from the secondary electron signal generated by that structure. Thus, it is important to understand how the actual dimension of the line being measured relates to the secondary electron signal. Since different features generate different signals, the same method of relating linewidth to signal cannot be used. For example, the peak to peak method may be used to accurately measure the linewidth of an isolated resist line; but, a threshold technique may be required for an isolated space in resist.


2017 ◽  
Vol 137 (2) ◽  
pp. 48-58
Author(s):  
Noriyuki Fujimori ◽  
Takatoshi Igarashi ◽  
Takahiro Shimohata ◽  
Takuro Suyama ◽  
Kazuhiro Yoshida ◽  
...  

Author(s):  
Noriyuki Nomoto ◽  
Yoshitomi Okazaki ◽  
Kenji Kuroda ◽  
Shunji Takenoiri ◽  
Toyonobu Yoshida

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