scholarly journals Case of Recent Fracture of Patella, Treated by Wire Suture

BMJ ◽  
1885 ◽  
Vol 1 (1262) ◽  
pp. 480-481 ◽  
Author(s):  
J. Hinton
Keyword(s):  
2016 ◽  
Vol 11 (1) ◽  
Author(s):  
F. Malgo ◽  
N. M. Appelman-Dijkstra ◽  
M. F. Termaat ◽  
H. J. L. van der Heide ◽  
I. B. Schipper ◽  
...  

2018 ◽  
Vol 16 (6) ◽  
pp. 738-745 ◽  
Author(s):  
Amanda D. Schnell ◽  
Jeffrey R. Curtis ◽  
Kenneth G. Saag

1975 ◽  
Author(s):  
T. Gaudernak ◽  
H. Kuderna ◽  
F. Olbert ◽  
H. Pelinka ◽  
G. Schlag

A randomized study was carried out on 50 patient suffering from lesions in the lower segment of the leg (fractures and ruptures of Achilles tendon). The patients were divided into two groups treated with Heparin (3x5000 i.u./die) and Dextran - 70 500 ml/die. respectively.The incidence of thrombosis was as high as 44%. In all cases, however, it remained limited to the veins of the tibial region. No significant difference was found between Heparin and Dextran patients.Control by phlebography carried out after one year in 38 patients indicated rechannelling of the affected veins in all patients. It also showed deep lesions of the veins in the form of a post-thrombotic syndrom (II/2) in three patients.This leads to the conclusion that immediate administration of Heparin or Dextran — 70 is strongly to be recommended for patients suffering from a recent fracture in the tibial region as a prophylactic measure against thrombosis. It greatly reduces the incidence of pulmonary emboli or of the frequent post-thrombotic syndrome.


2014 ◽  
Vol 695 ◽  
pp. 680-683
Author(s):  
E.P. Ooi ◽  
R. Daud ◽  
N.A.M. Amin ◽  
T.W. Hong

Solder joints failure due to thermal loads and mechanical loads is a significant reliability concern in electronic devices. From literatures, little attention is paid to the development of methods on predicting fracture behavior of solder joint under mixed-mode loading. In reality, the solder joints are exposed to drop impact, vibration loading, bending, and twisting of PCBs. Study on this matter will lead to prediction of fracture load, prevalent fracture mode, exact joint interconnect size and life of joints under brittle and fatigue failure. This paper presents a review of recent fracture analysis on solder joints.


1973 ◽  
Vol 16 (1) ◽  
pp. 67-68
Author(s):  
George F. Longstreth ◽  
Albert D. Newcomer ◽  
James R. Pluth
Keyword(s):  

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