56th Electronic Components and Technology Conference 2006
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Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

A Suggestion for High Power LED Package Based on LTCC

2006 ◽  
Author(s):  
Jung Kyu Park ◽  
Hyun Dong Shin ◽  
Young Sam Park ◽  
Sung Yeol Park ◽  
Ki Pyo Hong ◽  
...  
Keyword(s):  
High Power ◽  
High Power Led

scholarly journals Photolithography on Three Dimensional Substrates

2006 ◽  
Author(s):  
P. Ivey ◽  
R. McWilliam ◽  
A. Maiden ◽  
G. Williams ◽  
A. Purvis ◽  
...  
Keyword(s):  
Three Dimensional

A Study on Package Stacking Process for Package-on-Package (PoP)

2006 ◽  
Author(s):  
A. Yoshida ◽  
Jun Taniguchi ◽  
K. Murata ◽  
M. Kada ◽  
Y. Yamamoto ◽  
...  

Dominant Migration Element in Electrochemical Migration of Eutectic SnPb Solder Alloy

2006 ◽  
Author(s):  
Shin-Bok Lee ◽  
Ja-Young Jung ◽  
Young-Ran Yoo ◽  
Young-Bae Park ◽  
Young-Sik Kim ◽  
...  
Keyword(s):  
Solder Alloy ◽  
Electrochemical Migration ◽  
Snpb Solder ◽  
Eutectic Snpb
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