56th Electronic Components and Technology Conference 2006
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315
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Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Ultra Thin Hermetic Wafer level, Chip Scale Package

2006 ◽  
Author(s):  
L. Shiv ◽  
M. Heschel ◽  
H. Korth ◽  
S. Weichel ◽  
R. Hauffe ◽  
...  
Keyword(s):  
Wafer Level ◽  
Chip Scale Package

Wafer Thinning Solution for Wafer-Level-Capped MEMS Devices

2006 ◽  
Author(s):  
E.S. Lacsamana ◽  
M.G. Mena ◽  
R.M. Navarro ◽  
N. Kuan ◽  
T.R. Spooner
Keyword(s):  
Mems Devices ◽  
Wafer Level ◽  
Wafer Thinning

Application of Shadow Moir~ Technique to Board Level Manufacturing Technologies

2006 ◽  
Author(s):  
P. Geng ◽  
T. Bandorawalla ◽  
S. Cho ◽  
H. Hsiao ◽  
J. Kuchy ◽  
...  
Keyword(s):  
Manufacturing Technologies ◽  
Board Level

A Systematic Approach to Qualification of 90 nm Low-K Flip-Chip Packaging

2006 ◽  
Author(s):  
U. Vissa ◽  
N. Butel ◽  
J. Rowatt ◽  
C. Thielen ◽  
D. McCann ◽  
...  
Keyword(s):  
Flip Chip ◽  
Systematic Approach ◽  
Flip Chip Packaging ◽  
Low K

Dominant Migration Element in Electrochemical Migration of Eutectic SnPb Solder Alloy

2006 ◽  
Author(s):  
Shin-Bok Lee ◽  
Ja-Young Jung ◽  
Young-Ran Yoo ◽  
Young-Bae Park ◽  
Young-Sik Kim ◽  
...  
Keyword(s):  
Solder Alloy ◽  
Electrochemical Migration ◽  
Snpb Solder ◽  
Eutectic Snpb
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