52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)
Latest Publications

TOTAL DOCUMENTS

291

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

0780374304

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

UbBM (under bump metallization) study for Pb-free electroplating bumping : interface reaction and electromigration

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) ◽

10.1109/ectc.2002.1008261 ◽

2005 ◽

Cited By ~ 8

Author(s):

Se-Young Jang ◽

J. Wolf ◽

Woon-Seong Kwon ◽

Kyung-Wook Paik

Keyword(s):

Interface Reaction ◽

Under Bump Metallization

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Understanding modulus trends in ultra low K dielectric materials through the use of molecular modeling

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) ◽

10.1109/ectc.2002.1008276 ◽

2003 ◽

Cited By ~ 12

Author(s):

N. Iwamoto ◽

L. Moro ◽

B. Bedwell ◽

P. Apen

Keyword(s):

Molecular Modeling ◽

Dielectric Materials ◽

Low K

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Electrical conductive film for Flip-Chip Interconnection based on Z-axis conductors

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) ◽

10.1109/ectc.2002.1008249 ◽

2003 ◽

Cited By ~ 6

Author(s):

J.-C. Souriau ◽

C. Rossat ◽

A. Gasse ◽

P. Renard ◽

G. Poupon

Keyword(s):

Flip Chip ◽

Conductive Film

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Effect of carbon-fiber orientation on the EM shielding for the plastic laser module packages

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) ◽

10.1109/ectc.2002.1008333 ◽

2003 ◽

Author(s):

S.G. Dai ◽

P.L. Li ◽

W.S. Jou ◽

T.L. Wu ◽

W.H. Cheng

Keyword(s):

Carbon Fiber ◽

Fiber Orientation ◽

Laser Module

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Micropackaging using thin films as mechanical components

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) ◽

10.1109/ectc.2002.1008191 ◽

2003 ◽

Cited By ~ 2

Author(s):

P. Boyle ◽

D.F. Moore ◽

R.R.A. Syms

Keyword(s):

Thin Films ◽

Mechanical Components

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Development of OE integrated surface mount packaging

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) ◽

10.1109/ectc.2002.1008152 ◽

2003 ◽

Cited By ~ 1

Author(s):

Y. Kishida ◽

Y. Kuba ◽

R. Komeda ◽

T. Okumichi ◽

K. Setoguchi ◽

...

Keyword(s):

Surface Mount

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Superfine flip-chip interconnection in 20μm-pitch utilizing reliable microthin underfill technology for 3D stacked LSI

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) ◽

10.1109/ectc.2002.1008298 ◽

2003 ◽

Cited By ~ 5

Author(s):

M. Umemoto ◽

Y. Tomita ◽

T. Morifuji ◽

T. Ando ◽

T. Sato ◽

...

Keyword(s):

Flip Chip

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Optimization of fiber-laser coupling with respect to both the coupling efficiency and carrier-to-noise ratio: a novel design

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) ◽

10.1109/ectc.2002.1008064 ◽

2003 ◽

Cited By ~ 1

Author(s):

S.K. Mondal ◽

F.G. Shi

Keyword(s):

Fiber Laser ◽

Coupling Efficiency ◽

Noise Ratio ◽

Novel Design

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Reliability issues of Pb-free solder joints in electronic packaging technology

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) ◽

10.1109/ectc.2002.1008258 ◽

2003 ◽

Cited By ~ 17

Author(s):

K.N. Tu ◽

K. Zeng

Keyword(s):

Electronic Packaging ◽

Solder Joints ◽

Packaging Technology ◽

Free Solder

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Could shock tests adequately mimic drop test conditions?

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) ◽

10.1109/ectc.2002.1008151 ◽

2003 ◽

Cited By ~ 18

Author(s):

E. Suhir

Keyword(s):

Drop Test ◽

Test Conditions

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52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

UbBM (under bump metallization) study for Pb-free electroplating bumping : interface reaction and electromigration

Understanding modulus trends in ultra low K dielectric materials through the use of molecular modeling

Electrical conductive film for Flip-Chip Interconnection based on Z-axis conductors

Effect of carbon-fiber orientation on the EM shielding for the plastic laser module packages

Micropackaging using thin films as mechanical components

Development of OE integrated surface mount packaging

Superfine flip-chip interconnection in 20μm-pitch utilizing reliable microthin underfill technology for 3D stacked LSI

Optimization of fiber-laser coupling with respect to both the coupling efficiency and carrier-to-noise ratio: a novel design

Reliability issues of Pb-free solder joints in electronic packaging technology

Could shock tests adequately mimic drop test conditions?

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)
Latest Publications