Noise test method for dual-gate MOSFET device

2019 ◽  
Vol 33 (31) ◽  
pp. 1950387
Author(s):  
Xiaofei Jia ◽  
Wenhao Chen ◽  
Bing Ding ◽  
Liang He

In recent years, with the development of mesoscopic physics and nanoelectronics, the research on noise and testing technology of electronic components has been developed. It is well known that noise can characterize the transmission characteristics of carriers in nanoscale electronic components. With the continuous shrinking of the device size, the carrier transport of nanoscale MOSFET devices has been gradually transformed from the traditional drift-diffusion to become the quasi-ballistic or ballistic transport, and its current noise contains granular and thermal noise. The paper by Jeon et al. [The first observation of shot noise characteristics in 10-nm scale MOSFETs, in Proc. 2009 Symp. VLSI Technology (IEEE, Honolulu, 2009), pp. 48–49] presents the variation relation of 20 nm MOSFET current noise with source–drain current and voltage, and its current noise characteristic is between thermal noise and shot noise, so 20 nm MOSFET current noise is shot noise and thermal noise. The paper by Navid et al. [J. Appl. Phys. 101 (2007) 124501] shows through simulation that the 60 nm MOSFET current noise is suppressed shot noise and thermal noise. At present, the current noise has seriously affected the basic performance of the device, thus the circuit cannot work normally. Therefore, it is necessary to study the generation mechanism and characteristics of current noise in electronic components so as to suppress device noise, which can not only realize the reduction of device noise, but also play a positive role in the work-efficiency, life-span and reliability of electronic components.

2004 ◽  
Vol 04 (02) ◽  
pp. L297-L307 ◽  
Author(s):  
JONGHWAN LEE ◽  
GIJS BOSMAN

A 1/fγ drain current noise model for deep-submicron MOSFETs with ultrathin oxide is presented. Based on the number and correlated mobility fluctuation mechanisms, the model is derived incorporating a tunneling assisted-thermally activated process and a more realistic trap distribution inside the gate oxide layer. The effects of the device structure and processing technologies on the noise characteristics are taken into consideration through a quadratic mobility degradation factor, a parasitic resistance, a doping profile, and trap-related parameters. For ultrathin oxide MOSFETs, the trapping efficiency ratio and the scattering rate are expressed in terms of the trap distance and the inversion carrier density, enabling an accurate prediction of the noise behavior. From quantitative results simulated with extracted data, it is shown that the new model is applicable to design future CMOS devices and new device processing technologies, and is suitable to be implemented in circuit simulators.


2013 ◽  
Vol 12 (03) ◽  
pp. 1350014 ◽  
Author(s):  
VILIUS PALENSKIS ◽  
JONAS MATUKAS ◽  
JUOZAS VYŠNIAUSKAS ◽  
SANDRA PRALGAUSKAITĖ ◽  
HADAS SHTRIKMAN ◽  
...  

An analysis and investigation of noises of GaAs tunnel diodes, which abrupt p+-n+ profile was obtained by using amphoteric nature of silicon, were performed. The main scope of this work was to verify the concepts of the explanation of white noise characteristics on the ground of shot noise and on the ground of the Gupta theorem of thermal noise in resistive elements. The other scope was to investigate the peculiarities of low frequency noise in p+-n+ junctions formed by using amphoteric silicon nature.


1999 ◽  
Vol 598 ◽  
Author(s):  
P. V. Necliudov ◽  
D. J. Gundlach ◽  
T. N. Jackson ◽  
S. L. Rumyantsev ◽  
M. S. Shur

ABSTRACTWe studied the low frequency noise in top-contact pentacene Thin Film Transistors (TFTs). The relative spectral noise density of the drain current fluctuations SI/I2 had a form of 1/f noise in the measured frequency range 1Hz - 3.5kHz.Our studies of the noise dependencies on the gate-source VGS and drain-source VDS voltages showed that the dependencies differed from those observed for conducting polymers and resembled those reported for crystalline Si n-MOSFETs.To compare the device noise level with those of other devices and materials, we extracted the Hooge parameter α. In order to calculate the total number of carriers we used a model simulating the device DC characteristics, similar to that for amorphous Si TFTs. The extracted Hooge parameter was 0.04. For an organic material this is an extremely small value, which is three orders of magnitude smaller that the Hooge parameter values reported for conducting polymers and only several times higher than the values for amorphous Si TFTs.


2019 ◽  
Vol 22 (2) ◽  
pp. 025701 ◽  
Author(s):  
Naicheng Quan ◽  
Chunmin Zhang ◽  
Tingkui Mu ◽  
Siyuan Li ◽  
Caiyin You

2000 ◽  
Vol 39 (Part 1, No. 4B) ◽  
pp. 1974-1978 ◽  
Author(s):  
Nobuyuki Sano ◽  
Kazuya Matsuzawa ◽  
Mikio Mukai ◽  
Noriaki Nakayama
Keyword(s):  

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