Theoretical investigation of current‐noise characteristics in finite semiconductor superlattice with correlated thickness randomness

1995 ◽  
Vol 78 (10) ◽  
pp. 6079-6082 ◽  
Author(s):  
Shi‐Jie Xiong
2004 ◽  
Vol 04 (02) ◽  
pp. L297-L307 ◽  
Author(s):  
JONGHWAN LEE ◽  
GIJS BOSMAN

A 1/fγ drain current noise model for deep-submicron MOSFETs with ultrathin oxide is presented. Based on the number and correlated mobility fluctuation mechanisms, the model is derived incorporating a tunneling assisted-thermally activated process and a more realistic trap distribution inside the gate oxide layer. The effects of the device structure and processing technologies on the noise characteristics are taken into consideration through a quadratic mobility degradation factor, a parasitic resistance, a doping profile, and trap-related parameters. For ultrathin oxide MOSFETs, the trapping efficiency ratio and the scattering rate are expressed in terms of the trap distance and the inversion carrier density, enabling an accurate prediction of the noise behavior. From quantitative results simulated with extracted data, it is shown that the new model is applicable to design future CMOS devices and new device processing technologies, and is suitable to be implemented in circuit simulators.


2019 ◽  
Vol 33 (31) ◽  
pp. 1950387
Author(s):  
Xiaofei Jia ◽  
Wenhao Chen ◽  
Bing Ding ◽  
Liang He

In recent years, with the development of mesoscopic physics and nanoelectronics, the research on noise and testing technology of electronic components has been developed. It is well known that noise can characterize the transmission characteristics of carriers in nanoscale electronic components. With the continuous shrinking of the device size, the carrier transport of nanoscale MOSFET devices has been gradually transformed from the traditional drift-diffusion to become the quasi-ballistic or ballistic transport, and its current noise contains granular and thermal noise. The paper by Jeon et al. [The first observation of shot noise characteristics in 10-nm scale MOSFETs, in Proc. 2009 Symp. VLSI Technology (IEEE, Honolulu, 2009), pp. 48–49] presents the variation relation of 20 nm MOSFET current noise with source–drain current and voltage, and its current noise characteristic is between thermal noise and shot noise, so 20 nm MOSFET current noise is shot noise and thermal noise. The paper by Navid et al. [J. Appl. Phys. 101 (2007) 124501] shows through simulation that the 60 nm MOSFET current noise is suppressed shot noise and thermal noise. At present, the current noise has seriously affected the basic performance of the device, thus the circuit cannot work normally. Therefore, it is necessary to study the generation mechanism and characteristics of current noise in electronic components so as to suppress device noise, which can not only realize the reduction of device noise, but also play a positive role in the work-efficiency, life-span and reliability of electronic components.


1993 ◽  
Vol 297 ◽  
Author(s):  
J.M. Boudry ◽  
L.E. Antonuk

Pixelated imaging arrays consisting of hydrogenated amorphous silicon (a-Si:H) photodiode sensors and field effect transistors are under development for x-ray imaging. For such arrays it is important to quantify the sensor noise characteristics as these may, in some cases, limit the array performance for certain applications. The current-noise-power-spectra of ∼1 nm thick a- Si:H p-i-n sensors of various areas are presented. The power spectra were measured for different reverse bias voltages over a frequency range of ∼0.01 to 1.0 Hz. The power spectra revealed the noise to be composed primarily of flicker noise. The flicker noise showed a l/fbdependence where b ranged from ∼1.1 to 1.2. The magnitude of the flicker noise as a function of the sensor leakage current and the sensor area has been investigated and is presented.


JETP Letters ◽  
2007 ◽  
Vol 85 (1) ◽  
pp. 40-45 ◽  
Author(s):  
A. I. Oreshkin ◽  
V. N. Mantsevich ◽  
N. S. Maslova ◽  
D. A. Muzychenko ◽  
S. I. Oreshkin ◽  
...  

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