WaFFLe

Managing thermal imbalance in contemporary chip multi-processors (CMPs) is crucial in assuring functional correctness of modern mobile as well as server systems. Localized regions with high activity, e.g., register files, ALUs, FPUs, and so on, experience higher temperatures than the average across the chip and are commonly referred to as hotspots. Hotspots affect functional correctness of the underlying circuitry and a noticeable increase in leakage power, which in turn generates heat in a self-reinforced cycle. Techniques that reduce the severity of or completely eliminate hotspots can maintain functional correctness along with improving performance of CMPs. Conventional dynamic thermal management targets the cores to reduce hotspots but often ignores caches, which are known for their high leakage power consumption. This article presents WaFFLe , an approach that targets the leakage power of the last-level cache (LLC) and hotspots occurring at the cores. WaFFLe turns off LLC-ways to reduce leakage power and to generate on-chip thermal buffers. In addition, fine-grained DVFS is applied during long LLC miss induced stalls to reduce core temperature. Our results show that WaFFLe reduces peak and average temperature of a 16-core based homogeneous tiled CMP with up to 8.4 ֯ C and 6.2 ֯ C, respectively, with an average performance degradation of only 2.5 %. We also show that WaFFLe outperforms a state-of-the-art cache-based technique and a greedy DVFS policy.