A fast and usually linear algorithm for global flow analysis (abstract only)

1975 ◽  
Vol 18 (12) ◽  
pp. 716 ◽  
Author(s):  
Susan L. Graham ◽  
Mark Wegman
1976 ◽  
Vol 23 (1) ◽  
pp. 172-202 ◽  
Author(s):  
Susan L. Graham ◽  
Mark Wegman

2003 ◽  
pp. 217-225
Author(s):  
C. Leonard Berman ◽  
Louise H. Trevillyan

1992 ◽  
Vol 13 (4) ◽  
pp. 349-366 ◽  
Author(s):  
M.V Hermenegildo ◽  
R Warren ◽  
S.K Debray
Keyword(s):  

1986 ◽  
Vol C-35 (1) ◽  
pp. 77-81 ◽  
Author(s):  
Trevillyan ◽  
Joyner ◽  
Berman

2003 ◽  
Vol 125 (1) ◽  
pp. 139-143 ◽  
Author(s):  
Jerry Su ◽  
Sheng-Jye Hwang ◽  
Francis Su ◽  
Shou-Kang Chen

Various methodologies of wire sweep analysis have been introduced to get better prediction and matching the experimental measurements by many researchers. As more and more high pin-count packages (such as BGA, QFP) are used today, efficiency has become an important requirement besides accuracy for software used to predict wire sweep in IC packaging. This study introduces a newly developed wire sweep analysis solution (InPack), not only to meet the need of accuracy, but also enhance the efficiency for actual applications. It combines global flow analysis (C-MOLD) and structure analysis (ANSYS) to become a solution for general wire sweep analysis.


Sign in / Sign up

Export Citation Format

Share Document