Influence of Reducing Agent on Chemical Decomposition of Bis(3- sulfopropyl) Disulfide (SPS) in Cu Plating Bath

Author(s):  
Tae Young Kim ◽  
Jae Jeong Kim ◽  
Seunghoe Choe ◽  
Myung Hyun Lee ◽  
Jinuk Byun ◽  
...  
RSC Advances ◽  
2021 ◽  
Vol 11 (62) ◽  
pp. 39153-39168
Author(s):  
Bo Wu ◽  
Baizhao Tan ◽  
Guizhen Tan ◽  
Ming Zeng ◽  
Jinyi Luo ◽  
...  

In the Au(iii)–DMH based cyanide-free electroless gold plating bath, the added hypophosphite inhibited the black pad and improved the corrosion resistance of the Cu/Ni–P/Au coating.


Chemija ◽  
2020 ◽  
Vol 31 (1) ◽  
Author(s):  
Zita Sukackienė ◽  
Kornelija Antanavičiūtė ◽  
Jūratė Vaičiūnienė ◽  
Loreta Tamašauskaitė-Tamašiūnaitė ◽  
Arnas Naujokaitis ◽  
...  

Nickel boron (NiB) coatings were deposited onto copper using a nickelglycine (Ni-Gly) plating solution and morpholine borane (MB) as a reducing agent. It has been determined that using MB as a reducing agent in the Ni-Gly plating solution produces NiB coatings, which exhibit typical cauliflower-like textures. The deposition rate of the NiB coatings and their composition depend on the concentrations of the reducing agent (MB) and the ligand (Gly), in addition to the pH and temperature of the plating solution. The highest deposition rate (3.42 mg cm–2 h–1) of the NiB coating was obtained when the plating bath was operated at pH 5 and 60°C temperature. Using this method, NiB coatings containing 10–20 at.% of boron can be obtained.


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