Electroless deposition of Ni–P/Au coating on Cu substrate with improved corrosion resistance from Au(iii)–DMH based cyanide-free plating bath using hypophosphite as a reducing agent

In the Au(iii)–DMH based cyanide-free electroless gold plating bath, the added hypophosphite inhibited the black pad and improved the corrosion resistance of the Cu/Ni–P/Au coating.

Exploring the potential of high resolution inductively coupled plasma mass spectrometry towards non-destructive control and validation of electroless gold nanoparticles onto silicon nanowires hybrids

We present a novel effective strategy for non-destructive control and validation of sensors consisting of hybrid silicon nanowires deposited with gold nanoparticles (AuNPs/SiNWs) produced via a hydrofluoric acid-assisted electroless fabrication method.

BIOFUNCTIONALIZATION OF GOLD NANOSHELLS

Gold nanoshells were grown on monodispersed and aminopropyltriethoxysilane (APTES) functionalized silica nanoparticles cores with varying sizes ranging from 40-180 nm, which were prepared by Stober route. Gold shells were deposited onto the surface of silica NPs by using tetrakis(hydroxymethyl) phosphonium chloride and electroless gold plating method. The coverage of the gold nanoshells on the surfaces of the silica NPs was evaluated using surface plasmon resonance spectra and scanning electron microscope.