scholarly journals Effect of Adding Germanium to the Plating Bath for Electroless Tin Deposition using Titanium (III) as a Reducing Agent and Analysis of the Reaction Mechanism

2016 ◽  
Vol 67 (2) ◽  
pp. 105-110 ◽  
Author(s):  
Takemoto TAKAHASHI ◽  
Lei XU ◽  
Shigeru WATARIGUCHI ◽  
Kazutaka TAJIMA
Keyword(s):  
Reaction Mechanism ◽  
Reducing Agent ◽  
Plating Bath

Reaction mechanism in combustion synthesis of α-Si3N4 powder using NaN3

2008 ◽  
Vol 23 (10) ◽  
pp. 2720-2726 ◽  
Author(s):  
Shyan-Lung Chung ◽  
Chih-Wei Chang ◽  
F.J. Cadete Santos Aires
Keyword(s):  
Reaction Mechanism ◽  
Solid State ◽  
Nitrogen Source ◽  
Combustion Synthesis ◽  
Synthesis Method ◽  
Reducing Agent ◽  
Synthesis Reaction ◽  
Ammonium Halides ◽  
Nitridation Reaction ◽  
Combustion Synthesis Reaction

A combustion synthesis method for the synthesis of α-Si3N4 from a reactant compact composed of Si, NaN3, and NH4X and wrapped up with an igniting agent was investigated. Wrapping the reactant compact with the igniting agent (i.e., a mixture of Ti and C powders) was found necessary for the synthesis of Si3N4. In addition to NH4Cl, which was considered previously to function as a catalytic agent, other ammonium halides (i.e., NH4F, NH4Br, and NH4I) were found to be capable of catalyzing the synthesis reaction with NH4Cl being the most effective. Si3N4 could not be produced when NaN3 was replaced by C3H6N6. NaN3 was thus considered to exert an essential effect on the combustion synthesis reaction other than functioning as a solid-state nitrogen source as considered previously. It was proposed that Na vapor produced by decomposition of NaN3 reduces SiXx (formed by reaction of Si and NH4X), promoting the nitridation reaction to form Si3N4. NaN3 thus plays a role as a reducing agent in the synthesis reaction.

scholarly journals Electroless deposition of Ni–P/Au coating on Cu substrate with improved corrosion resistance from Au(iii)–DMH based cyanide-free plating bath using hypophosphite as a reducing agent

RSC Advances ◽  
2021 ◽  
Vol 11 (62) ◽  
pp. 39153-39168
Author(s):  
Bo Wu ◽  
Baizhao Tan ◽  
Guizhen Tan ◽  
Ming Zeng ◽  
Jinyi Luo ◽  
...  
Keyword(s):  
Corrosion Resistance ◽  
Electroless Deposition ◽  
Reducing Agent ◽  
Gold Plating ◽  
Plating Bath ◽  
Cu Substrate ◽  
Black Pad ◽  
Electroless Gold

In the Au(iii)–DMH based cyanide-free electroless gold plating bath, the added hypophosphite inhibited the black pad and improved the corrosion resistance of the Cu/Ni–P/Au coating.

scholarly journals Electroless deposition of nickel boron coatings using morpholine borane as a reducing agent

Chemija ◽  
2020 ◽  
Vol 31 (1) ◽  
Author(s):  
Zita Sukackienė ◽  
Kornelija Antanavičiūtė ◽  
Jūratė Vaičiūnienė ◽  
Loreta Tamašauskaitė-Tamašiūnaitė ◽  
Arnas Naujokaitis ◽  
...  
Keyword(s):  
Deposition Rate ◽  
Electroless Deposition ◽  
Reducing Agent ◽  
Plating Bath ◽  
Plating Solution

Nickel boron (NiB) coatings were deposited onto copper using a nickelglycine (Ni-Gly) plating solution and morpholine borane (MB) as a reducing agent. It has been determined that using MB as a reducing agent in the Ni-Gly plating solution produces NiB coatings, which exhibit typical cauliflower-like textures. The deposition rate of the NiB coatings and their composition depend on the concentrations of the reducing agent (MB) and the ligand (Gly), in addition to the pH and temperature of the plating solution. The highest deposition rate (3.42 mg cm–2 h–1) of the NiB coating was obtained when the plating bath was operated at pH 5 and 60°C temperature. Using this method, NiB coatings containing 10–20 at.% of boron can be obtained.

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