Quantitative Study of Electrochemical Reduction of Ag+to Ag Nanoparticles in Aqueous Solutions by a Plasma Cathode

Electrochemical reduction of ionic species during manganese deposition from sulphated aqueous solutions has been studied in an electrochemical reactor with two anionic exchange membranes.

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Investigation on the Effect of Addition of Fe3+ Ion into the Colloidal AgNPs in PVA Solution and Understanding Its Reaction Mechanism

Indonesian Journal of Chemistry ◽

10.22146/ijc.22695 ◽

2017 ◽

Vol 17 (3) ◽

pp. 439 ◽

Cited By ~ 1

Author(s):

Roto Roto ◽

Marcelina Marcelina ◽

Nurul Hidayat Aprilita ◽

Mudasir Mudasir ◽

Taufik Abdillah Natsir ◽

...

Keyword(s):

Silver Nanoparticles ◽

Reaction Mechanism ◽

Polyvinyl Alcohol ◽

Aqueous Solutions ◽

Surface Plasmon ◽

Ag Nanoparticles ◽

Capping Agents ◽

Colorimetric Methods

Analysis of Fe3+ ion present in aqueous solutions is always of interests. Recently, this ion has been analyzed by colorimetric methods using colloid of silver nanoparticles (AgNPs) in capping agents of polymers. The reaction mechanism between AgNPs and Fe3+ is still subject to the further investigation. In this work, 1,10-phenanthroline was used to probe the reaction mechanism between AgNPs and Fe3+ ion in the solution. The colloids of AgNPs were prepared in the polyvinyl alcohol (PVA) solution and reacted with Fe3+. The colloid surface plasmon absorbance decreases linearly along with the increase in Fe3+ concentration. The addition of 1,10-phenanthroline to mixture changes the solution to red, indicating that the reaction produces Fe2+. This suggests that the reduction of the AgNPs absorbance is the result of oxidation of the Ag nanoparticles along with the reduction of Fe3+.

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The electrochemical reduction of nitrate in low conductivity aqueous solutions

10.31979/etd.rpa5-5rjj ◽

2005 ◽

Cited By ~ 1

Author(s):

Xhavin Sinha

Keyword(s):

Aqueous Solutions ◽

Electrochemical Reduction

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Etching Volume Effect on the Morphology of Silicon Etched by Metal-Assisted Chemical Method

Applied Mechanics and Materials ◽

10.4028/www.scientific.net/amm.217-219.1141 ◽

2012 ◽

Vol 217-219 ◽

pp. 1141-1145 ◽

Cited By ~ 1

Author(s):

Wei Wang ◽

Li Juan Zhao ◽

Ping Xin Song ◽

Ying Jiu Zhang

Keyword(s):

Hydrogen Peroxide ◽

Aqueous Solutions ◽

Formation Mechanism ◽

Ag Nanoparticles ◽

Hydrofluoric Acid ◽

Chemical Method ◽

Volume Effect ◽

Etching Solution ◽

Si Substrates ◽

Si Nanostructures

Assisted by Ag nanoparticles, Si substrates were etched in aqueous solutions containing hydroﬂuoric acid (HF) and hydrogen peroxide (H2O2) with different volumes of etching solution. The etching morphology of Si wafers was found to be affected by the volumes. In etching solutions with smaller volume, the pores were created; in etching solutions with larger volume, the nanostructure composed of nanowires and nanopores (pores+wires nanostructure) were generated. In addition, the lengths of these Si nanostructures increased with the increase of the etching volume. Possible formation mechanism for this phenomenon was discussed.

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