(Keynote) Sensor Design, Construction and Validation for in-Situ Water Layer Thickness Determination during Accelerated Corrosion Testing

2020 ◽  
Vol MA2020-02 (13) ◽  
pp. 1328-1328
Author(s):  
Ryan Michael Katona ◽  
Shimpei Tokuda ◽  
Robert Kelly
CORROSION ◽  
10.5006/3852 ◽  
2021 ◽  
Author(s):  
Lindsey Blohm ◽  
Chao Liu ◽  
Robert Kelly

AA5456-H116 undergoes accelerated localized corrosion when in a galvanic couple with cupronickel alloy C70600 during ASTM G85 Appendix 2 Wet Bottom (G85 WB) testing. Surface and subsurface damage of AA5456-H116 was investigated and quantified. These results were compared to Finite Element Modeling results investigating relative humidity (RH) and water layer (WL) thickness. The best fit between experimental results and the modeling results was found when modeling assumed that a 3,000 µm water layer was formed during the spray portion of the G85 cycle with thinner water layers present during the decreasing RH portion of the cycle, which led IGC attack that was focused in the proximity of the CDA/AA5456-H116 interface. The high-water layer thickness is likely the result of the corrosion product formation that traps additional electrolyte than would be present on a clean surface.


CORROSION ◽  
10.5006/3443 ◽  
2020 ◽  
Vol 76 (4) ◽  
pp. 373-384
Author(s):  
Mary E. Parker ◽  
Russell Repasky ◽  
Srishti Shrivastava ◽  
Robert G. Kelly

In this work, the application of hydrogen peroxide (H2O2) and potassium persulfate (K2S2O8) in accelerated corrosion testing was considered. H2O2 is already used as an accelerant in the standard immersion test ASTM G110, and K2S2O8 is an oxidizing agent that shows promise for corrosion testing applications. A Koutecky-Levich approach was used to investigate the cathodic kinetics of both oxidizing agents as well as dissolved oxygen (O2). Cathodic kinetics for O2, H2O2, and S2O82− were faster when measured on a platinum electrode than when measured on an AA2060-T3 electrode. This difference was attributed to the additional limit to cathodic kinetics posed by the protective oxide film on aluminum. H2O2 was a more potent accelerant than K2S2O8 at a concentration of 0.1 M due to the faster cathodic kinetics of H2O2 on aluminum. However, K2S2O8 was more convenient to use in a laboratory setting due to its stability during storage. The severity of tests using K2S2O8 was increased by lowering the solution pH to 2.28. At the low solution pH, cathodic kinetics and extent of attack increased.


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