Evolution of fumarolic anhydrous copper sulfate minerals during successive hydration/dehydration

ABSTRACTThe copper sulfate minerals chalcanthite (CuSO4.5H20), antlerite (Cu3SO4(OH)4), and brochantite (Cu4SO4(OH)6) are observed as corrosion products on copper alloy objects such as statues which are exposed to weathering. The usual product in aqueous corrosion is brochantite, though posnjakite (Cu4SO4(OH)6H20) is also known. No copper sulfate mineral is commonly found in artifacts recovered from near-surface burial. These observations can be explained in terms of stability diagrams and microbiological activity.

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A New Concept of Organization of the Central Emetic Mechanism: Recent Studies on the Sites of Action of Apomorphine, Copper Sulfate And Cardiac Glycosides

Gastroenterology ◽

10.1016/s0016-5085(19)36357-7 ◽

1952 ◽

Vol 22 (1) ◽

pp. 1-12 ◽

Cited By ~ 167

Author(s):

S.C. Wang ◽

Herbert L. Borison

Keyword(s):

Copper Sulfate ◽

Cardiac Glycosides ◽

Sites Of Action

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Fate and forms of Cu in a reservoir ecosystem following copper sulfate treatment (Saint Germain les Belles, France)

Journal de Physique IV (Proceedings) ◽

10.1051/jp4:20030547 ◽

2003 ◽

Vol 107 ◽

pp. 1333-1336 ◽

Cited By ~ 2

Author(s):

E. Van Hullebusch ◽

P. Chatenet ◽

V. Deluchat ◽

P. M. Chazal ◽

D. Froissard ◽

...

Keyword(s):

Copper Sulfate

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Effects of Copper Sulfate and Zinc Chloride on Lymnaea stagnalis L.

Hydrobiological Journal ◽

10.1615/hydrobj.v42.i1.110 ◽

2006 ◽

Vol 42 (1) ◽

pp. 107-113

Author(s):

A. D. Vyskushenko

Keyword(s):

Copper Sulfate ◽

Zinc Chloride ◽

Lymnaea Stagnalis

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Influence of Solvents on the Growth of Copper Sulfate Pentahydrate Single Crystals

Diyala Journal for Pure Science ◽

10.24237/djps.1303.291c ◽

2017 ◽

Vol 13 (3) ◽

pp. 81-94

Author(s):

Tariq A. AL- Dhahir ◽

◽

Nabeel A. Bakr ◽

Saja B. Mohammed

Keyword(s):

Single Crystals ◽

Copper Sulfate ◽

Sulfate Pentahydrate ◽

Copper Sulfate Pentahydrate ◽

Influence Of Solvents

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Characteristics of copper sulfide nanoparticles obtained in the copper sulfate—sodium thiosulfate system

Журнал структурной химии ◽

10.26902/jsc20170715 ◽

2017 ◽

Vol 58 (7) ◽

pp. 1421-1428

Author(s):

K. S. Murasheva ◽

◽

S. V. Saikova ◽

S. A. Vorobiev ◽

A. S. Romanchenko ◽

...

Keyword(s):

Copper Sulfate ◽

Copper Sulfide ◽

Sodium Thiosulfate

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Whisker Formation in Copper Electroplating

ISTFA 2011: Conference Proceedings from the 37th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2011p0127 ◽

2011 ◽

Author(s):

Theresa Han ◽

Eunin Cho ◽

Jinwoo Heo ◽

Seoung Jae Lee

Keyword(s):

Copper Sulfate ◽

Surface Stress ◽

Whisker Formation ◽

Printed Wiring Boards ◽

Copper Electroplating ◽

Cu Electroplating ◽

Solution Surface ◽

Dry Film

Abstract In the manufacture of Printed Wiring Boards (PWB), unwelcome structures, such as nodules and whiskers can be formed during copper electroplating with copper sulfate. Copper (Cu) whiskers with lengths of up to a few hundred micrometers can lead to electrical shorts between layers or patterns. In this paper, we document factors that can affect the growth of Cu whiskers; decomposition of additives in the Cu electroplating solution, surface stress, acidic cleaner, and the ingredients of a dry film. Contaminants from outside of the electroplating bath and the ingredients of the dry film were shown as key components in the formation of Cu whiskers.

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