Experimental characterization and analytical prediction of microscopic deformation in interlaminar-toughened laminates with transverse cracks

2021 ◽  
pp. 309-317
Author(s):  
Nobuo Takeda ◽  
L. Neil McCartney ◽  
Shinji Ogihara
Keyword(s):  
Analytical Prediction ◽  
Experimental Characterization ◽  
Transverse Cracks ◽  
Microscopic Deformation

Evaluation of Microscopic Deformation in CFRP Laminates with Delamination by Micro-Grid Methods

1998 ◽  
Vol 32 (1) ◽  
pp. 83-100 ◽  
Author(s):  
Nobuo Takeda ◽  
Shinji Ogihara ◽  
Satoshi Suzuki ◽  
Akira Kobayashi
Keyword(s):  
Crack Opening ◽  
Displacement Fields ◽  
Transverse Cracks ◽  
Opening Displacement ◽  
Cfrp Laminates ◽  
Edge Surface ◽  
Micro Grid ◽  
Microscopic Deformation ◽  
Micro Grids ◽  
Specimen Edge

Micro-grid methods were applied to measure displacements in 90° ply in CFRP cross-ply laminates with only transverse cracks or with both transverse cracks and delaminations. The COD (crack opening displacement) of the transverse cracks were also measured. Micro-grids were printed on the specimen edge surfaces by using the photo-lithography technique. The displacement fields of the specimen edge surface obtained from the experiment were compared with McCartney's [1] and Lee et al.'s [2] analyses which predicted the displacement field of a cross-ply laminate with only transverse cracks. Furthermore these analyses were modified to consider the existence of delamination.

Experimental Characterization of the Reliability of 3-Terminal Dual-Damascene Copper Interconnect Trees

2002 ◽  
Vol 716 ◽  
Author(s):  
C. L. Gan ◽  
C. V. Thompson ◽  
K. L. Pey ◽  
W. K. Choi ◽  
F. Wei ◽  
...  
Keyword(s):  
Stress Conditions ◽  
Experimental Characterization ◽  
Contact Lines ◽  
Tree Structures ◽  
Similar Test ◽  
Dual Damascene ◽  
Copper Interconnect ◽  
Test Conditions

AbstractElectromigration experiments have been carried out on simple Cu dual-damascene interconnect tree structures consisting of straight via-to-via (or contact-to-contact) lines with an extra via in the middle of the line. As with Al-based interconnects, the reliability of a segment in this tree strongly depends on the stress conditions of the connected segment. Beyond this, there are important differences in the results obtained under similar test conditions for Al-based and Cu-based interconnect trees. These differences are thought to be associated with variations in the architectural schemes of the two metallizations. The absence of a conducting electromigrationresistant overlayer in Cu technology, and the possibility of liner rupture at stressed vias lead to significant differences in tree reliabilities in Cu compared to Al.

ANALYTICAL PREDICTION OF THE EXIT FLOW OF CAVITATING ORIFICES

1997 ◽  
Vol 7 (6) ◽  
pp. 603-616 ◽  
Author(s):  
David P. Schmidt ◽  
Michael L. Corradini
Keyword(s):  
Analytical Prediction

Experimental Characterization of Mechanical Behavior of Cord-Rubber Composites

1982 ◽  
Vol 10 (1) ◽  
pp. 37-54 ◽  
Author(s):  
M. Kumar ◽  
C. W. Bert
Keyword(s):  
Response Characteristic ◽  
Cord Compression ◽  
Complete Characterization ◽  
Strain Response ◽  
Strain Gages ◽  
Experimental Characterization ◽  
Rubber Composites ◽  
Stress Strain ◽  
Strain Data

Abstract Unidirectional cord-rubber specimens in the form of tensile coupons and sandwich beams were used. Using specimens with the cords oriented at 0°, 45°, and 90° to the loading direction and appropriate data reduction, we were able to obtain complete characterization for the in-plane stress-strain response of single-ply, unidirectional cord-rubber composites. All strains were measured by means of liquid mercury strain gages, for which the nonlinear strain response characteristic was obtained by calibration. Stress-strain data were obtained for the cases of both cord tension and cord compression. Materials investigated were aramid-rubber, polyester-rubber, and steel-rubber.

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