OS4-6 Measurement of 3-Dimensional Internal Strain Field in Power Module Package by Synchrotron Laminography and Volumetric Digital Image Correlation Method(3D/4D image-based analyses and simulations 2,OS4 3D/4D image-based analyses and simulations,MEASUREMENT METHODS)

Author(s):  
Takashi Asada ◽  
Hidehiko Kimura ◽  
Satoshi Yamaguchi ◽  
Yujiro Hayashi ◽  
Ken Uyama
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