Bonding Strength of Ceramic to Metal Joint Cutting Free Surface Edges

2017 ◽  
Vol 2017 (0) ◽  
pp. 109
Author(s):  
Reiichi TOKUMOTO ◽  
Takashi TOMINAGA ◽  
Eiichiriu YOKOI ◽  
Masayoshi TATENO
Author(s):  
Masayoshi Tateno ◽  
Eiichirou Yokoi

This study was performed to clarify dependences of bonding strength on the interface wedge angle in the metal side of ceramic-to-metal joint. Each plate Si3N4 and Ni used for this experiment is produced by wire electric discharge machining. The geometric interface shape at the edge of the interface is characterized by wedge angle on both side of the ceramic and metal defined as a configuration angle between the free surface of each material and the interface. As the wedge angle of Si3N4 is a right angle, the wedge angle of Ni is set from 30° to 180°. Joint specimens were bonded at high temperature using braze metal of 0.05mm thickness under vacuum and cooled slowly. The tensile bonding strength of the ceramic-to-metal joint was evaluated to determine the optimum interface shape. The highest bonding strength appeared under identical interface conditions where the fracture pattern changed. This study provided a useful geometric interface shape to improve the tensile bonding strength of ceramic-to-metal joint.


2019 ◽  
Vol 6 (3) ◽  
pp. 18-00566-18-00566
Author(s):  
Reiichi TOKUMOTO ◽  
Syunsuke MURAOKA ◽  
Takashi TOMINAGA ◽  
Masayoshi TATENO

Author(s):  
Masayoshi Tateno ◽  
Hiroki Morikawa ◽  
Kunio Kokubo

This study was performed to clarify the dependence of ceramic-to-metal joint bonding strength on the interface wedge angle on the ceramic side. Plate Si3N4-to-Ni joints with a plane interface were produced by electric discharge machining. The geometric interface shape at the edge of the interface is characterized by wedge angle on both sides of the ceramic and metal defined as a configuration angle between the free surface of each material and the interface. As the wedge angle of Ni is a right angle, the wedge angle of Si3N4 is set from 30° to 180°. Joints were bonded at high temperature using thin braze metal under vacuum and cooled slowly. The tensile bonding strength of the ceramic-to-metal joint was evaluated to determine the optimum interface shape. The highest bonding strength appeared under identical interface conditions where the fracture pattern changed. The optimum wedge angle to obtain the greatest bonding strength appears to depend on bonding temperature. This study provided a useful geometric interface shape to improve the tensile bonding strength of ceramic-to-metal joints.


2010 ◽  
Vol 2010 (0) ◽  
pp. 148-149
Author(s):  
Eiichirou YOKOI ◽  
Hiroki MORIKAWA ◽  
Takahiro MIURA ◽  
Masayoshi TATENO

Author(s):  
Masayoshi Tateno ◽  
Yoshiaki Hagiwara ◽  
Kunio Kokubo

The focus of this study is to clarify the effect of the interface edge shape on the bonding strength of ceramic to metal joint. Each silicon nitride to copper joint plate with arc-shaped free surfaces edge was produced by Electric Discharge machining (EDM). The interface edge shape was characterized by defining the edge angle as a configuration angle between the interface plane and tangential line at the arc edge of the bonded interface. Each joint was bonded at high temperature using thin braze metal under vacuum and slowly cooled. Good fit was achieved at each bonded face in this process. The dependence of the bonding strength on the edge angle was experimentally clarified in Silicon nitride to Copper joint with arc-shaped free surfaces. The result shows that changing the edge angle from right angle improves bonding strength since it decreases residual stress near the interface edge. The highest bonding strength appears at the specific interface where the fracture pattern changes. It also shows that secondary machining, which cuts both edges into optimum geometrical conditions after bonding, can improve bonding strength.


2009 ◽  
Vol 2009 (0) ◽  
pp. 226-227
Author(s):  
Takahiro MIURA ◽  
Masayoshi TATENO ◽  
Kunio KOKUBO

Author(s):  
S. L. Ngoh ◽  
S. C. Tan ◽  
C. S. Goh ◽  
J. Wei

Adhesive bonding offers many advantages, such as light weight, ease of manufacturing, corrosion resistance and more uniform stress distribution at joint. In order to achieve good initial adhesion and durability of adhesive bonded aluminum joint, pre-treatment of the aluminum substrate is essential. Some of the surface pre-treatment procedures commonly used are chromium-based chemical and electro-chemical methods. However, due to the environmental and health concerns, and legislation to ban the use of hexavalent chromium, there is a need to omit the use of chromium-based pre-treatment methods in the surface preparation process. Therefore, this work aims to study the effect of the developed hybrid chromium-free surface pre-treatment method on the bonding strength of adhesive bonded aluminum joint. The study on the effects of solution concentration level and processing time of the hybrid treatment on the bonding strength suggests that bonding strength can be improved through enhancement of mechanical interlocking and increase of bonding area between the adhesive and adherend. Even though comparable or rougher surface morphologies were obtained from hybrid treatments as compared to the chromium-based treatment, lower bonding strengths were observed. This further suggests that the nano-scale level interaction between the adhesive and adherend has vital effect on the bonding performance.


Author(s):  
Masayoshi Tateno ◽  
Eiichiro Yokoi

The focus of this study is to clarify a dependence of bonding strength of ceramic to metal joint on interface wedge angle in metal side. Each plate Si3N4-to-Cu or Ni joint with plane interface is produced by electric discharge machining. Geometrical shape at the edge of the interface is characterized by wedge angle defined as a configuration angle between free surface of each material and the interface. As the wedge angle of Si3N4 is right angle, the wedge angle of metal is set over from 30° to 180°. Each joint is bonded at high temperature by using thin braze metal under vacuum and slowly cooled. Tensile bonding strength of the joint is evaluated. Result shows that decrease of the wedge angle of metal side from right angle improves the bonding strength since it decreases the residual stress near edge of the interface on ceramic side. The highest bonding strength appears at the identical interface condition where fracture pattern changes. It appears that optimum edge angle for obtaining the highest bonding strength depends on bonding temperature and combination of bonded materials. This paper provides a useful geometrical interface shape to improve tensile bonding strength of ceramic to metal joint.


2016 ◽  
Vol 2016.24 (0) ◽  
pp. 204
Author(s):  
Yuki NAKAYAMA ◽  
Takashi TOMINAGA ◽  
Eiichirou YOKOI ◽  
Masayoshi TATENO

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