scholarly journals Transient Heat Conduction and Thermal Stress Analyses of a Compound Plate Subjected to Concentrated Sunlight

2013 ◽  
Vol 79 (805) ◽  
pp. 1396-1400 ◽  
Author(s):  
Ryuusuke KAWAMURA ◽  
Fumiya TOKUMARU ◽  
Yoshinori NAGASE ◽  
Shigeki TOMOMATSU
Keyword(s):  
Heat Conduction ◽  
Thermal Stress ◽  
Transient Heat Conduction ◽  
Compound Plate ◽  
Stress Analyses

Transient Thermal Stress Analysis of the Typical Structures in Turbine Rotor Based on Thermomechanical Analysis

2014 ◽  
Author(s):  
Ning Xu ◽  
Zhansheng Liu ◽  
He Peng
Keyword(s):  
Finite Element ◽  
Heat Conduction ◽  
Thermal Stress ◽  
Thermal Stresses ◽  
Transition Process ◽  
Transient Heat Conduction ◽  
Work Conditions ◽  
Turbine Rotor ◽  
Design Stage ◽  
Turbine Rotors

Thermal stress is one of the most important monitoring parameters in turbine rotors during the transition of work conditions. It has significant influence on the safety and life of turbine rotors. In order to obtain the thermal stress in turbine rotors during the transition process conveniently, the transient heat conduction process in typical structures of turbine rotors is analyzed based on heat conduction equation and finite element simulation. According to thermomechanical principle, thermal stress distributions in the typical structures of turbine rotor are investigated. The solutions of thermal stress in a solid cylinder are derived. A corner formed by shaft and disc is modeled and analyzed by finite element method, and the influences of structure parameters on thermal stresses are studied. The results on thermal stresses in cylinder and corner structures could provide a continent method to estimate thermal stress of turbine rotor on early design stage.

Non-Fourier Heat Conduction in IC Chip

1995 ◽  
Vol 117 (3) ◽  
pp. 174-177 ◽  
Author(s):  
Zeng-Yuan Guo ◽  
Yun-Sheng Xu
Keyword(s):  
Heat Conduction ◽  
Thermal Stress ◽  
Thermal Noise ◽  
Wave Model ◽  
Transient Heat Conduction ◽  
Peak Temperature ◽  
Spatial Difference ◽  
Thermal Reliability ◽  
Fourier Heat Conduction ◽  
Fourier Equation

Instead of the classic Fourier equation based on diffusion, a hyperbolic equation based on a wave model has been used to predict the rapid transient heat conduction in IC chips. The peak temperature, spatial difference, and time variation of temperature, which are critical to thermal reliability of the chip, are given and compared with that obtained from the Fourier equation. Analytical and numerical results show that non-Fourier effects, including the higher peak temperature and thermal stress, greater temperature difference between components, and stronger thermal noise, are significant to IC chip reliability.

Coupled heat conduction and thermal stress analyses in particulate composites

2011 ◽  
Vol 43 (10) ◽  
pp. 608-625 ◽  
Author(s):  
Kamran A. Khan ◽  
Romina Barello ◽  
Anastasia H. Muliana ◽  
Martin Lévesque
Keyword(s):  
Heat Conduction ◽  
Thermal Stress ◽  
Particulate Composites ◽  
Stress Analyses

Thermo-Mechanical and Hygro-Mechanical Stress Analyses of an Organic Multilayer Sheet

2007 ◽  
Author(s):  
Toru Ikeda ◽  
Tomonori Mizutani ◽  
Noriyuki Miyazaki
Keyword(s):  
Liquid Crystal ◽  
Heat Conduction ◽  
Thermal Stress ◽  
Liquid Crystal Display ◽  
Mechanical Strain ◽  
Thermal Strain ◽  
Transient Heat Conduction ◽  
Fick’S Law ◽  
Fick's Law ◽  
Liquid Crystal Display Panel

A polarizing plate, which is an important part of a liquid crystal display panel, is made by sandwiching an organic polarizer between protecting films. An organic polarizer is both a hygroscopic and orthotropic material. The hygroscopic swelling and drying shrinkage of the organic polarizer can cause the polarizing plate to crack and the liquid crystal display panel to warp. The diffusion coefficient and Henry’s law coefficient were measured using a thermo-gravimetric analyzer (TGA) under controlled humidity, while the coefficient of moisture expansion (CME) was measured using a thermo-mechanical analyzer (TMA), also under controlled humidity. The thermo-mechanical and hygro-mechanical deformation of a polarizing plate was analyzed using the finite element method (FEM). This analysis was performed as follows. The distribution of the moisture concentration was analyzed according to Fick’s law. The equation of Fick’s law is similar to that of the transient heat conduction, and the FEM for the transient heat conduction was utilized for the transient diffusion analysis. The hygro-mechanical analysis was then carried out in a way similar to the thermal stress analysis. Thermal stress was analyzed separately using the FEM. Finally, the obtained hygro-mechanical strain and stress were added to the thermal strain and stress, respectively. The measured CME of a polarizing plate corresponds to the analyzed CME using the CMEs of a polarizer and protecting films. The warpage of a liquid crystal display panel sometimes causes light leakage along the frame of the display panel due to contact of the display panel with the bezel of the frame. The warpage was analyzed according to the thermo-mechanical strain and the hygro-mechanical strain. The contact between the display panel and the bezel, which causes the light leakage, was estimated.

TRANSIENT HEAT CONDUCTION IN ANISOTROPIC SOLIDS

1974 ◽  
Author(s):  
Kozo Katayama ◽  
Akio Saito ◽  
Nariyoshi Kobayashi
Keyword(s):  
Heat Conduction ◽  
Transient Heat Conduction
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