scholarly journals 125  GHz sine wave gating InGaAs/InP single-photon detector with a monolithically integrated readout circuit

2017 ◽  
Vol 42 (24) ◽  
pp. 5090 ◽  
Author(s):  
Wen-Hao Jiang ◽  
Jian-Hong Liu ◽  
Yin Liu ◽  
Ge Jin ◽  
Jun Zhang ◽  
...  
2011 ◽  
Vol 19 (14) ◽  
pp. 13497 ◽  
Author(s):  
Min Ren ◽  
Xiaorong Gu ◽  
Yan Liang ◽  
Weibin Kong ◽  
E. Wu ◽  
...  

2011 ◽  
Vol 19 (19) ◽  
pp. 18593 ◽  
Author(s):  
T. Ortlepp ◽  
M. Hofherr ◽  
L. Fritzsch ◽  
S. Engert ◽  
K. Ilin ◽  
...  

2018 ◽  
Vol 27 (8) ◽  
pp. 080305
Author(s):  
Lin-Xi Feng ◽  
Mu-Sheng Jiang ◽  
Wan-Su Bao ◽  
Hong-Wei Li ◽  
Chun Zhou ◽  
...  

Author(s):  
Yunhao Fu ◽  
Zhongyuan Zhao ◽  
Hongbo Zhang ◽  
Jiaqi Jiang ◽  
Yuchun Chang

2018 ◽  
Vol 89 (12) ◽  
pp. 123104 ◽  
Author(s):  
Wen-Hao Jiang ◽  
Xin-Jiang Gao ◽  
Yu-Qiang Fang ◽  
Jian-Hong Liu ◽  
Yong Zhou ◽  
...  

2012 ◽  
Vol 83 (8) ◽  
pp. 083111 ◽  
Author(s):  
Xiao-Lei Liang ◽  
Jian-Hong Liu ◽  
Quan Wang ◽  
De-Bing Du ◽  
Jian Ma ◽  
...  

Author(s):  
Franco Stellari ◽  
Peilin Song ◽  
Todd A. Christensen

Abstract In this paper we present the advanced optical testing of an array fabricated in IBM’s 65 nm SOI CMOS technology, using the Picosecond Imaging Circuit Analysis (PICA) [1-11] tool equipped with the Superconducting Single-Photon Detector (SSPD) [12,13]. Based on the results of the optical analysis we were able to confirm a time collision problem in the readout circuit of the array. In the following sections we will also discuss the use of an innovative optical packaging for testing chips requiring wire-bonding, along with record low voltage optical measurements, down to 0.7 V.


2017 ◽  
Vol 110 (11) ◽  
pp. 111104 ◽  
Author(s):  
De-Yong He ◽  
Shuang Wang ◽  
Wei Chen ◽  
Zhen-Qiang Yin ◽  
Yong-Jun Qian ◽  
...  

Author(s):  
A. V. Tronev ◽  
M. V. Parfenov ◽  
I. V. Ilichev ◽  
P. M. Agruzov ◽  
A. M. Ionov ◽  
...  

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