Analysis of the Synergistic Integration of DFMT with CAPP and MP in Metal Parts Manufacturing based on Cost Analysis and Systematic Algorithm

2023 ◽  
Vol 18 (1) ◽  
pp. 1
Author(s):  
Thorsten Wuest ◽  
Kenneth R. Currie ◽  
Bhaskaran Gopalakrishnan ◽  
Omar Al Shebeeb ◽  
Todd Hamrick
Author(s):  
R.S. Mhetre ◽  
R.J. Dhake

In all manufacturing plants the machines and equipment’s are influenced by deterioration in performance due to its age and use, obsolescence due to improvement in technology and failure due to unplanned maintenance Improper maintenance leads to unavailability of machine Hence the effective maintenance becomes useful in improving equipment life, reducing manufacturing cost, improving quality and minimizing the many unforeseen losses which are responsible for reducing the potential of the manufacturing plant. This paper addresses the issue by taking a case study of a manufacturing company. Detailed analysis and calculations are carried out on data collected through discussion, interview and observations. The overall equipment effectiveness (OEE) calculation is used to find out the current situation of the production system of the case company. It calculates the availability of the production system which shows that maintenance system’s effectiveness. The quality rate calculations of the work stations show the conditions of the machines and the worker’s skill and the calculations of the performance efficiency of the work stations show the utilization of the machines. The result of analysis is presented here with recommendations to the company.


Author(s):  
M. J. Carr ◽  
J. F. Shewbridge ◽  
T. O. Wilford

Strong solid state bonds are routinely produced between physical vapor deposited (PVD) silver coatings deposited on sputter cleaned surfaces of two dissimilar metal parts. The low temperature (200°C) and short time (10 min) used in the bonding cycle are advantageous from the standpoint of productivity and dimensional control. These conditions unfortunately produce no microstructural changes at or near the interface that are detectable by optical, SEM, or microprobe examination. Microstructural problems arising at these interfaces could therefore easily go undetected by these techniques. TEM analysis has not been previously applied to this problem because of the difficulty in specimen preparation. The purpose of this paper is to describe our technique for preparing specimens from solid state bonds and to present our initial observations of the microstructural details of such bonds.


1989 ◽  
Vol 7 (1) ◽  
pp. 27-41 ◽  
Author(s):  
Norman Keith Womer
Keyword(s):  

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