A fracture mechanics approach to enhance product and process sustainability in diamond wire sawing of silicon wafers for solar cells through improved wire design

2020 ◽  
Vol 4 (2/3/4) ◽  
pp. 186
Author(s):  
Shreyes N. Melkote ◽  
Arkadeep Kumar
Keyword(s):  
Solar Cells ◽  
Fracture Mechanics ◽  
Silicon Wafers ◽  
Diamond Wire ◽  
Diamond Wire Sawing ◽  
Product And Process

scholarly journals A microscopic TEM study of the defect layers in cast-mono crystalline silicon wafers induced by diamond-wire sawing

AIP Advances ◽  
2021 ◽  
Vol 11 (4) ◽  
pp. 045103
Author(s):  
Hangfei Li ◽  
Xuegong Yu ◽  
Xiaodong Zhu ◽  
Chuanhong Jin ◽  
Shenglang Zhou ◽  
...  
Keyword(s):  
Crystalline Silicon ◽  
Silicon Wafers ◽  
Diamond Wire ◽  
Diamond Wire Sawing

scholarly journals Effect of Surface Structure on Electrical Performance of Industrial Diamond Wire Sawing Multicrystalline Si Solar Cells

2018 ◽  
Vol 2018 ◽  
pp. 1-4 ◽  
Author(s):  
Shaoliang Wang ◽  
Xianfang Gou ◽  
Su Zhou ◽  
Junlin Huang ◽  
Qingsong Huang ◽  
...  
Keyword(s):  
Solar Cells ◽  
Surface Structure ◽  
High Efficiency ◽  
Multicrystalline Silicon ◽  
Electrical Performance ◽  
Silicon Solar Cells ◽  
Diamond Wire ◽  
Diamond Wire Sawing ◽  
The Difference ◽  
Effect Of Surface

We report industrial fabrication of different kinds of nanostructured multicrystalline silicon solar cells via normal acid texturing, reactive ion etching (RIE), and metal-assisted chemical etching (MACE) processes on diamond wire sawing wafer. The effect of different surface structure on reflectivity, lifetime, and electrical performance was systematically studied in this paper. The difference between industrial acid, RIE, and MACE textured multicrystalline silicon solar cells to our knowledge has not been investigated previously. The resulting efficiency indicates that low reflectivity surface structure with the size of 0.2–0.8 μm via RIE and MACE process do not always lead to low lifetime compared with acid texturing process. Both RIE and MACE process is promising candidate for high efficiency processes for future industrial diamond wire sawing multicrystalline silicon solar cells.

Evaluation of fixed abrasive diamond wire sawing induced subsurface damage of solar silicon wafers

2019 ◽  
Vol 273 ◽  
pp. 116267 ◽  
Author(s):  
Huapan Xiao ◽  
Hairong Wang ◽  
Na Yu ◽  
Rongguang Liang ◽  
Zhe Tong ◽  
...  
Keyword(s):  
Subsurface Damage ◽  
Silicon Wafers ◽  
Diamond Wire ◽  
Solar Silicon ◽  
Diamond Wire Sawing ◽  
Fixed Abrasive
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