6 HEMP protection strategy for power system’s electronic equipment

2021 ◽  
pp. 80-87
2010 ◽  
Vol E93-B (7) ◽  
pp. 1788-1796 ◽  
Author(s):  
Takanori UNO ◽  
Kouji ICHIKAWA ◽  
Yuichi MABUCHI ◽  
Atsushi NAKAMURA ◽  
Yuji OKAZAKI ◽  
...  

2007 ◽  
Vol 38 (3) ◽  
pp. 245-258 ◽  
Author(s):  
Leonid L. Vasiliev ◽  
Andrei G. Kulakov ◽  
L. L. Vasiliev, Jr ◽  
Mikhail I. Rabetskii ◽  
A. A. Antukh

Author(s):  
J. P. Lejannou ◽  
M. Cadre ◽  
A. Latrobe ◽  
A. Viault

2011 ◽  
Vol 70 (8) ◽  
pp. 731-734 ◽  
Author(s):  
N. D. Koshevoy ◽  
E. M. Kostenko ◽  
V. A. Gordienko ◽  
V. P. Syroklyn
Keyword(s):  

2017 ◽  
Vol 16 (8) ◽  
pp. 1807-1817 ◽  
Author(s):  
Fabiana Tornese ◽  
Maria Grazia Gnoni ◽  
Giorgio Mossa ◽  
Giovanni Mummolo ◽  
Rossella Verriello

Author(s):  
Chris Muller ◽  
Chuck Arent ◽  
Henry Yu

Abstract Lead-free manufacturing regulations, reduction in circuit board feature sizes and the miniaturization of components to improve hardware performance have combined to make data center IT equipment more prone to attack by corrosive contaminants. Manufacturers are under pressure to control contamination in the data center environment and maintaining acceptable limits is now critical to the continued reliable operation of datacom and IT equipment. This paper will discuss ongoing reliability issues with electronic equipment in data centers and will present updates on ongoing contamination concerns, standards activities, and case studies from several different locations illustrating the successful application of contamination assessment, control, and monitoring programs to eliminate electronic equipment failures.


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