scholarly journals Analysis of Using Acoustic Microscopy to Evaluate Defects in Spot Welding Joints

2016 ◽  
Vol 61 (2) ◽  
pp. 1009-1019 ◽  
Author(s):  
M. Korzeniowski ◽  
B. Białobrzeska

AbstractThe article presents the possibilities of using acoustic microscopy to evaluate defects in resistance spot welding joints. For this purpose, the welded joints were made from two grades of aluminium plates EN AW5754 H24 and EN AW6005 T606, which were then subjected to non-destructive testing using acoustic microscopy and conventional destructive testing using traditional light microscopy techniques. Additionally, the study examined the influence of the typical contaminants found in industrial conditions on the quality of the joint.

2013 ◽  
Vol 764 ◽  
pp. 9-13 ◽  
Author(s):  
Zhen Ying Xu ◽  
Shu Yuan Gao ◽  
Jun Huang ◽  
Yun Wang

The inner structure and defects of the silicon panel will influence the transfer efficiency and the stability of the polycrystalline solar cells, thus the non-destructive testing of the silicon panel is very important. In this paper, a Scan Acoustic Microscopy is applied to test the inner structure of polycrystalline silicon solar panel. From the grey image of C-Scan by the microscopy, the amplitude distribution of the bottom wave generated by the interaction between the inner grains of the polycrystalline silicon and the acoustic beam can be seen clearly. Furthermore, the defects as well as their size and position can also be tested by A-Scan, B-Scan and C-Scan with high resolution and high accuracy. The experiment results show that it is a good non-destructive method to test and evaluate the quality of the inner structure of polycrystalline silicon solar panel.


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